Semiconductor package having an optical device and the method of making the same

• US 20070090503A1
• Filed: 10/02/2006
• Published: 04/26/2007
• Est. Priority Date: 10/21/2005
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Huang, Cheng-Wei
• Granted Patent: US 7,485,899 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

The present invention relates to a semiconductor package having an optical device and the method of making the same. The semiconductor package comprises: a transparent substrate, a chip, an optical device and a carrier substrate. The transparent substrate has a plurality of first contacts and second contacts, wherein the first contacts are electrically connected to the second contacts. The chip is connected to the transparent substrate and forms a gap therebetween. The chip has a plurality of third contacts that are electrically connected to the first contacts. The optical device is disposed in the gap. The carrier substrate has a receiving space and a plurality of fourth contacts, wherein the receiving space accommodates the chip and the optical device, and the fourth contacts are electrically connected to the second contacts of the transparent substrate. Therefore, no connecting wires are needed and the step of wire bonding is omitted. Also, only one transparent substrate is used in the semiconductor package of the present invention.

Claims

1. A semiconductor package having an optical device, comprising:

a transparent substrate, having a plurality of first contacts and a plurality of second contacts, the first contacts electrically connecting to the second contacts;

a chip, connecting to the transparent substrate and forming a gap therebetween, and having a plurality of third contacts for electrically connecting to the first contacts;

an optical device, disposed in the gap; and

a carrier substrate, having a receiving space and a plurality of fourth contacts, the receiving space for accommodating the chip and the optical device, and the fourth contacts for electrically connecting to the second contacts of the transparent substrate.

2. The semiconductor package according to claim 1, wherein the transparent substrate further comprises a first surface and a second surface, and the first contacts and the second contacts are formed on the second surface.

3. The semiconductor package according to claim 1, wherein the chip further comprises a first surface and a second surface, and the third contacts are formed on the first surface.

4. The semiconductor package according to claim 1, further comprising a first connecting element for connecting the chip and the transparent substrate to form the gap therebetween.

5. The semiconductor package according to claim 4, wherein the first connecting element comprises a spacer and an adhesive material, the spacer is used to form the gap between the chip and the transparent substrate, and the adhesive material is used to encapsulate the spacer so as to connect the chip and the transparent substrate.

6. The semiconductor package according to claim 1, wherein the optical device is disposed on the transparent substrate.

7. The semiconductor package according to claim 1, wherein the optical device is disposed on the chip.

8. The semiconductor package according to claim 1, wherein the optical device comprises at least one micro lens group, the micro lens group comprising:

a supporting element, having a first end and a second end;

a hinge, disposed at the first end of the supporting element; and

a micro lens, having an end for connecting to the hinge so that the micro lens revolves around the hinge.

9. The semiconductor package according to claim 8, wherein the second end of the supporting element is disposed on the transparent substrate.

10. The semiconductor package according to claim 8, wherein the second end of the supporting element is disposed on the chip.

11. The semiconductor package according to claim 1, wherein the material of the transparent substrate is glass.

12. The semiconductor package according to claim 1, wherein the chip is a CMOS chip.

13. The semiconductor package according to claim 1, wherein the carrier substrate is ceramic.

14. The semiconductor package according to claim 1, wherein the carrier substrate has a circumfluent wall for defining the receiving space, and the fourth contacts are disposed on the top of the circumfluent wall.

15. The semiconductor package according to claim 14, wherein the circumfluent wall has an inner portion and an outer portion, the outer portion is higher than the inner portion to form a ladder-shaped structure, and the fourth contacts are disposed on the top of the inner portion.

16. The semiconductor package according to claim 1, further comprising a second connecting element for electrically and physically connecting the second contacts and the fourth contacts.

17. The semiconductor package according to claim 16, wherein the second connecting element is an anisotropic conductive film (ACF).

18. The semiconductor package according to claim 15, further comprising a third connecting element for connecting the outer portion and the transparent substrate.