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Semiconductor device with improved encapsulation

  • US 20070090545A1
  • Filed: 10/24/2005
  • Published: 04/26/2007
  • Est. Priority Date: 10/24/2005
  • Status: Abandoned Application
First Claim
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1. A semiconductor device, comprising:

  • a die support;

    a semiconductor die mounted on a portion of the die support;

    a plastic encapsulation on at least part of the die support and the die;

    wherein the plastic encapsulation comprises at least two components;

    a plastic binder having a dielectric constant ε

    band loss tangent δ

    b; and

    a filler material having a lower dielectric constant ε

    f and/or lower loss tangent δ

    f, mixed with the plastic binder to form the plastic encapsulation having combined dielectric constant ε

    m and loss tangent δ

    m, such that either ε

    m<

    ε

    b or δ

    m<

    δ

    b or both ε

    m<

    ε

    b and δ

    m<

    δ

    b.

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