Semiconductor device with improved encapsulation
First Claim
1. A semiconductor device, comprising:
- a die support;
a semiconductor die mounted on a portion of the die support;
a plastic encapsulation on at least part of the die support and the die;
wherein the plastic encapsulation comprises at least two components;
a plastic binder having a dielectric constant ε
band loss tangent δ
b; and
a filler material having a lower dielectric constant ε
f and/or lower loss tangent δ
f, mixed with the plastic binder to form the plastic encapsulation having combined dielectric constant ε
m and loss tangent δ
m, such that either ε
m<
ε
b or δ
m<
δ
b or both ε
m<
ε
b and δ
m<
δ
b.
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Accused Products
Abstract
Structure and method are provided for plastic encapsulated semiconductor devices. The encapsulation comprises a plastic binder having a dielectric constant εb and loss tangent δb and a filler mixed therewith having lower εf and/or δf so that εm and/or δm of the mix is less than εb, δb, respectively. Hollow microspheres of varied sizes are preferred fillers, desirably in the size range of about 0.3 to 300 micrometers. These should comprise at least about 50%, more preferably 60 to 70% or more of the mixture by volume so that the resulting mix has εm<3, preferably <2.5 and δm<0.005. The encapsulant mixture is placed in proximity to or on the die so that the fringing electric fields of the die, die wiring and/or die connections are exposed to a lower ε and/or δ than that of a plastic encapsulation without the filler.
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Citations
20 Claims
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1. A semiconductor device, comprising:
-
a die support;
a semiconductor die mounted on a portion of the die support;
a plastic encapsulation on at least part of the die support and the die;
wherein the plastic encapsulation comprises at least two components;
a plastic binder having a dielectric constant ε
band loss tangent δ
b; and
a filler material having a lower dielectric constant ε
f and/or lower loss tangent δ
f, mixed with the plastic binder to form the plastic encapsulation having combined dielectric constant ε
m and loss tangent δ
m, such that either ε
m<
ε
b or δ
m<
δ
b or both ε
m<
ε
b and δ
m<
δ
b. - View Dependent Claims (2, 3, 4, 5)
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6. A plastic encapsulated semiconductor device, comprising:
-
a semiconductor die;
a plastic encapsulation covering one or more faces of the die, wherein the plastic encapsulation comprises a binder having dielectric constant ε
b and loss tangent δ
b and a filler material mixed together so as to have a resulting dielectric constant δ
m and loss tangent δ
m such that either ε
m<
ε
b or δ
m<
δ
b or both ε
m<
ε
b and δ
m<
δ
b. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of encapsulating a semiconductor die, comprising:
-
mounting the die on a support;
placing the support with the die in a mold suitable for plastic encapsulation, wherein the die is located in a cavity in the mold;
placing a plastic encapsulant in the cavity of the mold to substantially encapsulate the semiconductor die, wherein the encapsulant comprises a mixture of a plastic resin having a dielectric constant ε
b and loss tangent δ
b and a filler material that imparts to the mixture a dielectric constant ε
m and loss tangent δ
m, wherein either ε
m<
ε
b or δ
m<
δ
b or both ε
m<
ε
b and δ
m<
δ
b. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification