LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION

• US 20070090737A1
• Filed: 07/20/2006
• Published: 04/26/2007
• Est. Priority Date: 10/20/2005
• Status: Abandoned Application

• Current Assignee: Foxconn Technology Co., Ltd.
• Original Assignee: Foxconn Technology Co., Ltd.
• Inventors: HSIEH, YIH-JONG, HU, TSENG-HSIANG, TAN, LI-KUANG
• Application Number:
  US11/309,256
• Publication Number:
  US 20070090737A1
• Time in Patent Office: Days
• US Class Current: 313/11
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/56 using liquid coolants F21V29/51 takes precedence
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A light-emitting diode (LED) assembly and a method for fabrication thereof are disclosed. The LED assembly includes a heat-absorbing member in which a working fluid is provided, an LED die (60) directly attached to the heat-absorbing member, and a heat-dissipating member thermally attached to the heat-absorbing member. The heat-absorbing member absorbs heat via the working fluid from the LED die and transfers the heat to the heat-dissipating member for dissipation. The method involves directly attaching the LED die to the heat-absorbing member.

Claims

1. A light-emitting diode (LED) assembly, comprising:

a heat-absorbing member in which a working fluid is provided;

an LED die directly attached to the heat-absorbing member; and

a heat-dissipating member thermally attached to the heat-absorbing member, the heat-absorbing member absorbing heat via the working fluid from the LED die and transferring the heat to the heat-dissipating member for dissipation.

2. The assembly of claim 1, wherein the heat-absorbing member includes a heat pipe having a flat surface to which the LED die is directly attached.

3. The assembly of claim 2, wherein the heat-dissipating member includes a heat sink, the heat sink defines a groove therein, the groove having a shape conforming to that of the heat pipe and receiving the heat pipe therein.

4. The assembly of claim 3, wherein the heat sink includes a chassis and a plurality of fins extending from a top surface of the chassis, the groove being defined at a bottom surface of the heat sink.

5. The assembly of claim 1, wherein the heat-absorbing member includes a vapor chamber-based heat spreader having a flat surface to which the LED die is directly attached.

6. The assembly of claim 5, wherein the heat-dissipating member includes a plurality of fins thermally attached to a surface of the heat spreader opposite to said flat surface.

7. The assembly of claim 1, wherein the heat-absorbing member includes a cold plate in which a flow channel is defined for passage of the working fluid.

8. The assembly of claim 7, wherein the heat-dissipating member includes a heat exchanger, the heat exchanger being fluidically connected to the flow channel via a plurality of connecting pipes, the working fluid being circulated between the cold plate and the heat exchanger.

9. The assembly of claim 1, wherein the heat-absorbing member defines a recess therein, the recess accommodating the LED die therein.

10. The assembly of claim 1, further comprising a circuit board, the circuit board defining a through hole therein, the LED die being placed in the through hole.

11. The assembly of claim 10, wherein the heat-absorbing member has a protrusion thereon, the protrusion being positioned in the through hole of the circuit board.

12. A method of packaging a light-emitting diode (LED), comprising:

providing a heat-absorbing member wherein a working fluid is provided in the heat-absorbing member;

attaching an LED die directly to the heat-absorbing member; and

thermally attaching a heat-dissipating member to the heat-absorbing member.

13. The method of claim 12, wherein the heat-absorbing member includes a heat pipe to which the LED die is directly attached, the heat-dissipating member includes a heat sink, and the heat sink defines a groove for receiving the heat pipe therein.

14. The method of claim 12, wherein the heat-absorbing member includes a vapor chamber-based heat spreader to which the LED die is directly attached, and the heat-dissipating member includes a plurality of fins thermally attached to the heat spreader.

15. The method of claim 12, further comprising a step of providing a circuit board which defines a through hole therein and placing the LED die in the through hole.

16. An LED assembly comprising:

a circuit board;

a plurality of LED dies electrically mounted on the circuit board, each having a first surface and an opposite second surface;

a heat-absorbing member thermally connecting with the first surfaces of the LED dies, wherein the heat-absorbing member has liquid therein;

a heat-dissipating member thermally connecting with the heat-absorbing member for dissipating heat from the heat-absorbing member to a surrounding atmosphere; and

a plurality of light penetrable packing layers encapsulating the second surfaces of the LED dies, respectively.

17. The LED assembly of claim 16, wherein the heat-absorbing member is a heat pipe and the heat-dissipating member is a heat sink having a plurality of fins and a groove defined in a bottom thereof, the groove receiving the heat pipe therein.

18. The LED assembly of claim 17, wherein the heat pipe has a recess defined in a bottom surface thereof, and the LED dies are received in the recess.

19. The LED assembly of claim 16, wherein the heat-absorbing member is a vapor chamber and the heat-dissipating member is a plurality of fins attached on a top surface of the vapor chamber.

20. The LED assembly of claim 19, wherein a bottom surface of the vapor chamber forms a plurality of protrusions fittingly extending through holes defined in the printed circuit board to thermally connect with the LED dies.