Impingement cooling of components in an electronic system
First Claim
Patent Images
1. A cooling apparatus adapted for usage in an electronic system comprising:
- an air mover;
at least one heat sink configured with multiple fins; and
at least one flexible tubing segment coupled to the air mover and configured to direct airflow onto the at least one heat sink for impingement cooling.
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Abstract
A cooling apparatus adapted for impingement cooling of electronic components in an electronic system comprises an air mover, one or more heat sinks configured with multiple fins, and one or more flexible tubing segments. The flexible tubing segments are coupled to the air mover and are configured to direct airflow onto the heat sinks for impingement cooling.
49 Citations
20 Claims
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1. A cooling apparatus adapted for usage in an electronic system comprising:
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an air mover;
at least one heat sink configured with multiple fins; and
at least one flexible tubing segment coupled to the air mover and configured to direct airflow onto the at least one heat sink for impingement cooling. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic system comprising:
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a chassis;
at least one electronic component distributed in the chassis; and
a cooling apparatus adapted for usage in the electronic system comprising;
an air mover;
at least one heat sink configured with multiple fins and associated with selected ones of the at least one electronic components; and
at least one flexible tubing segment coupled to the air mover and configured to direct airflow onto the at least one heat sink for impingement cooling. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of cooling an electronic system comprising:
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arranging at least one heat sink in a configuration adapted to cool one or more selected electronic components in the electronic system;
attaching an air mover in association with the electronic system;
attaching at least one flexible tubing segment to the air mover; and
arranging the at least one tubing segment in a configuration that directs airflow onto the at least one heat sink for impingement cooling. - View Dependent Claims (15, 16)
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17. A method of cooling an electronic component comprising:
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positioning a heat sink adjacent the electronic component;
blowing an airflow stream onto the heat sink with a high velocity sufficient for impingement cooling of the electronic component. - View Dependent Claims (18, 19)
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20. A cooling apparatus adapted for usage in an electronic system comprising:
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an air mover;
a heat sink configured with multiple fins and adapted for cooling an associated electronic component; and
a flexible tubing segment coupled between the heat sink and the air mover and configured to pull air across the heat sink and associated component.
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Specification