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Method of making light emitting device with silicon-containing encapsulant

  • US 20070092737A1
  • Filed: 10/21/2005
  • Published: 04/26/2007
  • Est. Priority Date: 10/21/2005
  • Status: Abandoned Application
First Claim
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1. A method of making a light emitting device, the method comprising the steps of:

  • (A) providing a light emitting diode; and

    (B) contacting the light emitting diode with a photopolymerizable composition comprising;

    a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation;

    a first metal-containing catalyst that may be activated by actinic radiation; and

    a second metal-containing catalyst that may be activated by heat but not the actinic radiation; and

    (C) heating the photopolymerizable composition to a temperature of less than 150°

    C. to initiate hydrosilylation, thereby forming a first encapsulant, wherein hydrosilylation comprises reaction between the silicon-bonded hydrogen and the aliphatic unsaturation.

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