Low cost high-pressure sensor

• US 20070095144A1
• Filed: 11/03/2005
• Published: 05/03/2007
• Est. Priority Date: 11/03/2005
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Piascik, James, Oboodi, Reza
• Granted Patent: US 7,260,994 B2
• Time in Patent Office: Days
• US Class Current: 73/715
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm

Abstract

A pressure sensing apparatus including a thin disc of a metal having a ceramic material layer and piezoresistive elements formed thereon. A surface of the disc is bonded to a diaphragm assembly on a pressure port base constructed of a low cost metal. The bonding process is performed at low temperatures, (<700° C.), so that the diaphragm assembly and pressure port do not require high temperature corrosion resistance, and can thus be formed of less expensive materials. The inventive apparatus provides a lower cost alternative to conventional high pressure sensors since less material is used, less expensive materials are used, and fabrication is less complex. The inventive apparatus is also more reliable and exhibits greater thermal stability than conventional high pressure sensors.

Claims

1. A pressure sensing apparatus which comprises:

a) a pressure port having an upper surface and a base portion;

b) an elastically deformable pressure-sensitive diaphragm assembly having upper and lower surfaces and a central pressure-sensitive diaphragm;

the lower surface of the diaphragm assembly being attached onto the upper surface of the pressure port;

c) a substantially planar disc having upper and lower surfaces;

the lower surface of the disc being bonded to the upper surface of the diaphragm assembly via a layer of a bonding material;

d) a ceramic material layer on the upper surface of the disc; and

e) a plurality of piezoresistive elements on the ceramic material layer.

2. The apparatus of claim 1 further comprising signal detection circuitry electrically connected to the plurality of piezoresistive elements.

3. The apparatus of claim 1 wherein the disc comprises metal.

4. The apparatus of claim 3 wherein the disc comprises stainless steel, nickel, aluminum, or combinations and/or alloys thereof.

5. The apparatus of claim 4 wherein the disc comprises an oxidation resistant aluminum alloy.

6. The apparatus of claim 1 wherein the disc comprises a ceramic material.

7. The apparatus of claim 6 wherein the disc comprises alumina, zirconia, silica, or combinations thereof.

8. The apparatus of claim 1 wherein the disc has a thickness ranging from about 0.025 mm to about 1.5 mm.

9. The apparatus of claim 1 wherein the disc has a diameter ranging from about 0.3 mm to about 30 mm.

10. The apparatus of claim 1 wherein the diaphragm assembly comprises stainless steel, nickel, aluminum, or combinations and/or alloys thereof.

11. The apparatus of claim 1 wherein the diaphragm has a thickness ranging from about 0.125 mm to about 4.5 mm.

12. The apparatus of claim 1 wherein the diaphragm has a diameter ranging from about 0.3 mm to about 30 mm.

13. The apparatus of claim 1 which further comprises a ceramic material layer on the lower surface of the disc.

14. The apparatus of claim 1 wherein the ceramic material layer comprises a ceramic coating which has been coated onto the disc.

15. The apparatus of claim 1 wherein the ceramic material layer comprises alumina, zirconia, silica, glass, or combinations thereof.

17. The apparatus of claim 1 wherein the bonding material comprises an organic adhesive, glass, ceramic, metal, or combinations thereof.

18. The apparatus of claim 1 wherein the bonding material comprises an epoxy adhesive.

19. The apparatus of claim 1 wherein the bonding material comprises a metal solder or braze.

16. The apparatus of claim 16 wherein the ceramic material layer comprises crystallizable glass or filled glass.

20. A method for forming a pressure sensing apparatus which comprises:

a) providing a substantially planar disc having upper and lower surfaces;

b) forming a ceramic material layer on the upper surface of the disc;

c) forming a plurality of piezoresistive elements on the ceramic material layer;

d) providing a pressure port having an upper surface and a base portion;

e) attaching a deformable pressure-sensitive diaphragm assembly, having upper and lower surfaces and a central pressure-sensitive diaphragm, onto the pressure port such that the lower surface of the diaphragm assembly is attached onto the upper surface of the pressure port; and

f) bonding the lower surface of the disc to the upper surface of the diaphragm assembly.

21. The method of claim 20 wherein steps (a)-(f) are conducted sequentially.

22. The method of claim 20 wherein the pressure sensing apparatus further comprises electrically connecting signal detection circuitry to the plurality of piezoresistive elements.

23. The method of claim 20 wherein the ceramic material layer comprises a ceramic coating which has been coated onto the disc.

24. The method of claim 20 wherein the bonding of the diaphragm assembly to the disc is conducted at a temperature of about 700°

C. or less.

25. The method of claim 20 wherein the disc comprises stainless steel, nickel, aluminum, or combinations and/or alloys thereof.

26. The method of claim 20 wherein the disc comprises alumina, zirconia, or combinations thereof.

27. The method of claim 20 wherein the ceramic material layer comprises alumina, zirconia, silica glass, or combinations thereof.

28. A method for sensing pressure, which comprises:

I) providing a pressure sensing apparatus comprising;

a) a pressure port having an upper surface and a base portion;

b) an elastically deformable pressure-sensitive diaphragm assembly having upper and lower surfaces and a central pressure-sensitive diaphragm;

the lower surface of the diaphragm assembly being attached onto the upper surface of the pressure port;

c) a substantially planar disc having upper and lower surfaces;

the lower surface of the disc being bonded to the upper surface of the diaphragm assembly via a layer of a bonding material;

d) a ceramic material layer on the upper surface of the disc; and

e) a plurality of piezoresistive elements on the ceramic material layer;

II) placing the pressure sensing apparatus into a pressurized environment, thereby causing the diaphragm to deform in response to changes in pressure;

III) detecting any changes in pressure of the pressurized environment via the piezoresistive elements; and

IV) analyzing the pressure of the pressurized environment by observing changes in the piezoresistive elements.