Semiconductor devices with dielectric layers and methods of fabricating same
First Claim
Patent Images
1. A semiconductor device comprising:
- at least one silicon carbide layer; and
an insulating layer disposed over the silicon carbide layer, wherein the insulating layer comprises glass or ceramic material.
1 Assignment
0 Petitions
Accused Products
Abstract
A SiC semiconductor device with a SiC layer and an insulating layer is provided. The insulating layer may include glass or ceramic. The thermal expansion coefficient of the insulating layer may be matched to that of SiC to reduce stress at the interface. A method of processing the SiC semiconductor device is also provided.
25 Citations
27 Claims
-
1. A semiconductor device comprising:
-
at least one silicon carbide layer; and
an insulating layer disposed over the silicon carbide layer, wherein the insulating layer comprises glass or ceramic material. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A semiconductor device comprising:
-
a silicon carbide layer; and
an insulating material layer disposed over the silicon carbide layer, wherein a thermal expansion coefficient of the insulating material is matched to a thermal expansion coefficient of the silicon carbide to reduce stress at a silicon carbide layer-insulating material layer interface. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A method of fabricating a silicon carbide device comprising:
-
providing a silicon carbide layer; and
providing an insulating layer over the silicon carbide layer;
wherein the insulating layer comprises a glass material or a ceramic material. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
-
Specification