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Manufacture of mountable capped chips

  • US 20070096296A1
  • Filed: 12/20/2006
  • Published: 05/03/2007
  • Est. Priority Date: 02/25/2003
  • Status: Active Grant
First Claim
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1. An in-process element comprising:

  • (a) a wafer with a main surface, structure defining an upper surface above said main surface and depressions extending downwardly from said upper surface toward said main surface, the wafer also having contacts in said depressions;

    (b) a terminal-bearing element having a plurality of electrically-conductive terminals overlying said upper surface and secured thereto; and

    (c) a plurality of leads extending into said depressions and connecting said terminals to said contacts.

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