Method and apparatus for automatic test equipment

• US 20070096755A1
• Filed: 10/28/2005
• Published: 05/03/2007
• Est. Priority Date: 10/28/2005
• Status: Active Grant

• Current Assignee: Teradyne Incorporated
• Original Assignee: Teradyne Incorporated
• Inventors: Parrish, Frank, Brecht, Brian, Castellano, Derek
• Granted Patent: US 7,541,819 B2
• Time in Patent Office: Days
• US Class Current: 324/756.02
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07364 with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Abstract

The traditional device interface board is replaced by a number of smaller strips containing one or more electrical components for interfacing the device under test and the test head. The device interface modules may mount to a stiffening member having a back bone and multiple ribs running through the stiffening member. The device interface strips can create a lattice-like structure for the interface circuitry. Individual circuits may be disposed on the interface strips to perform functionality relating to the device under test and/or the test head.

Claims

1. A modularized device interface comprising:

a stiffening member having a backbone disposed in the stiffening member;

a plurality of device interface strips disposed on the stiffening member, the plurality of device interface strips extending from the backbone; and

at least one electrical component disposed on each of the plurality of device interface strips.

2. The modularized device interface of claim 1, wherein the electrical component comprises an electrical trace.

3. The modularized device interface of claim 1, wherein the electrical component comprises an integrated circuit.

4. The modularized device interface of claim 1, wherein the plurality of device interface strips have a first end and a second end, the plurality of device interface strips having an alignment hole at the first end, further comprising:

alignment pins on the stiffening member, the alignment pins engaging the alignment holes of the first end of each of the plurality of device interface strips.

5. The modularized device interface of claim 1, further comprising a grounding insert located between two device interface strips of the plurality of device interface strips, the grounding insert in electrical communication with electrically-conductive edges of the two device interface strips.

6. The modularized device interface of claim 1, wherein the backbone comprises a communication board for docking the plurality of device interface strips with a test head, the communication board electrically connecting the plurality of device interface strips.

7. The modularized device interface of claim 1, wherein the stiffening member further comprises at least one rib.

8. The modularized device interface of claim 7, wherein the stiffening member comprises a substantially rectangular frame having a central backbone spanning the stiffening member, the at least one rib spanning the stiffening member.

9. A method of testing electrical equipment comprising:

affixing a plurality of device interface strips to a stiffening member, the plurality of device interface strips each having at least one electrical component disposed thereon; and

electrically coupling the at least one electrical component to a test head, the test head having a controller driving the testing.

10. The method of claim 9, wherein the affixing step comprises mounting the plurality of device interface strips to a backbone of the stiffening member, the plurality of device interface strips extending from the backbone to an outer edge of the stiffening member.

11. The method of claim 9, further comprising affixing each of the plurality of device interface strips to at least one rib, the rib substantially parallel to the backbone.

12. The method of claim 9, further comprising aligning each of the plurality of device interface strips with an alignment pin, each of the device interface strips having an alignment hole for engagement with the alignment pin of the stiffening member.

13. The method of claim 9, wherein, in the affixing step, a communication board is provided for docking the plurality of device interface strips with the test head, the communication board electrically coupled to the plurality of device interface strips.

14. The method of claim 9, wherein, in the affixing step, a communication board is provided for mating with the plurality of device interface strips, the communication board electrically coupled to at least one electrical component disposed on each device interface strip of the plurality of device interface strips.

15. A modularized device interface comprising:

a stiffening member having an outer edge having alignment pins and mounting holes, a backbone extending the length of the stiffening member, the backbone having a plurality of mounting holes and at least one rib forming at least one sidewalk;

a plurality of device interface strips disposed on the stiffening member, each of the plurality of device interface strips having a first end and a second end, each of the plurality of device strips extending from the backbone; and

at least one electrical component for performing a dedicated functionality disposed on the plurality of device interface strips.

16. The modularized device interface of claim 15, wherein the plurality of device interface strips have a first end and a second end, each of the plurality of device interface strips having an alignment hole at the first end, further comprising:

alignment pins on the outer edge of the stiffening member, the alignment pins of the stiffening member engaging the alignment holes of the plurality of device interface strips.

17. The modularized device interface of claim 15, further comprising a communication board for docking the plurality of device interface strips with a test head, the communication board electrically coupled to the plurality of device interface strips.

18. The modularized device interface of claim 15, wherein each device interface strip of the plurality of device interface strips contains a plurality of mounting holes.

19. A modularized device interface comprising:

a stiffening member;

a plurality of device interface strips disposed on the stiffening member, each device interface strip of the plurality of device interface strips having at least one electrically-conductive edge proximate to a neighboring device interface strip;

at least one electrical component disposed on each of the plurality of device interface strips; and

a grounding insert located between two device interface strips of the plurality of device interface strips, the grounding insert in electrical communication with electrically-conductive edges of the two device interface strips.

20. The modularized device interface of claim 19, wherein the electrical component comprises an integrated circuit.

21. The modularized device interface of claim 19, further comprising:

a communication board mounted to the stiffening member and electrically coupled to at least one electrical component disposed on each device interface strip of the plurality of device interface strips;

wherein an end of each device interface strip of the plurality of device interface strips is electrically coupled to the communication board.