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Electronics assembly having multiple side cooling and method

  • US 20070097627A1
  • Filed: 10/28/2005
  • Published: 05/03/2007
  • Est. Priority Date: 10/28/2005
  • Status: Active Grant
First Claim
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1. An electronics assembly comprising:

  • a substrate;

    at least one electronics package supported on the substrate, said electronics package comprising electrical circuitry and first and second side surfaces;

    a first heat sink device positioned in thermal conductive communication with the first side surface of the electronics package; and

    a second heat sink device positioned in thermal conductive communication with the second side surface of the electronics package.

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