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Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

  • US 20070097653A1
  • Filed: 11/03/2005
  • Published: 05/03/2007
  • Est. Priority Date: 11/03/2005
  • Status: Active Grant
First Claim
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1. A heat sink grounding spring, comprising:

  • a base comprising a conductive material having a generally planar portion, wherein the generally planar portion of the base is configured to contact at least a portion of a peripheral surface of a heat sink;

    a multiple-jointed spring finger comprising a conductive material extending from the generally planar portion of the base.

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