Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
First Claim
1. A heat sink grounding spring, comprising:
- a base comprising a conductive material having a generally planar portion, wherein the generally planar portion of the base is configured to contact at least a portion of a peripheral surface of a heat sink;
a multiple-jointed spring finger comprising a conductive material extending from the generally planar portion of the base.
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Accused Products
Abstract
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger'"'"'s tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.
283 Citations
20 Claims
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1. A heat sink grounding spring, comprising:
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a base comprising a conductive material having a generally planar portion, wherein the generally planar portion of the base is configured to contact at least a portion of a peripheral surface of a heat sink;
a multiple-jointed spring finger comprising a conductive material extending from the generally planar portion of the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A circuit card assembly, comprising:
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a printed circuit board having an electronic module mounted on a surface thereof;
a heat sink disposed over the surface of the printed circuit card and in thermal contact with the module;
a grounding spring comprising a conductive material having an opening formed in a generally planar base portion thereof through which the heat sink and the module are in thermal contact with each other, wherein the base portion makes electrical contact with at least a portion of a peripheral surface of the heat sink, and wherein a plurality of multiple-jointed spring fingers extend from the base portion to make electrical contact with conductive pads on the surface of the printed circuit board. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for grounding a heat sink in thermal contact with an electronic module, comprising the sets of:
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providing a printed circuit board having an electronic module mounted on a surface thereof;
disposing a heat sink over the surface of the printed circuit card and in thermal contact with the module;
interposing a grounding spring between the printed circuit board and the heat sink, wherein the grounding spring comprises a conductive material having an opening formed in a generally planar base portion thereof through which the heat sink and the module are in thermal contact with each other, wherein the base portion of the grounding spring makes electrical contact with at least a portion of a peripheral surface of the heat sink, and wherein a plurality of multiple-jointed spring fingers extend from the base portion of the grounding spring to make electrical contact with conductive pads on the surface of the printed circuit board. - View Dependent Claims (19, 20)
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Specification