Vapor deposition apparatus and method

• US 20070098891A1
• Filed: 10/31/2005
• Published: 05/03/2007
• Est. Priority Date: 10/31/2005
• Status: Abandoned Application

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Tyan, Yuan-Sheng, Long, Michael, Cushman, Thomas, Phelan, Giana
• Application Number:
  US11/263,106
• Publication Number:
  US 20070098891A1
• Time in Patent Office: Days
• US Class Current: 427/248.1
• CPC Class Codes: C23C 14/228 Gas flow assisted PVD deposition
• CPC Class Codes: C23C 14/243 Crucibles for source material C23C14/28, C23C14/30 take precedence
• CPC Class Codes: C23C 14/246 Replenishment of source material

Abstract

A method is disclosed for depositing a layer onto a substrate, including heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited; dispensing into the evaporator one or more quantized units of the evaporant that completely vaporizes; introducing a flow of a carrier gas into the evaporator before, during, or after vaporization of the evaporant so as to cause a flow of the mixture of the carrier gas and the vapor of the evaporant; and directing the flow of the mixture onto the surface of the substrate to form the layer.

Claims

1. A method of depositing a layer onto a substrate, comprising:

a) heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited;

b) dispensing into the evaporator one or more quantized units of the evaporant that completely vaporizes;

c) introducing a flow of a carrier gas into the evaporator before, during, or after vaporization of the evaporant so as to cause a flow of the mixture of the carrier gas and the vapor of the evaporant; and

d) directing the flow of the mixture onto the surface of the substrate to form the layer.

2. The method of claim 1 wherein at least one of the quantized units contains two or more evaporants.

3. The method according to claim 1 wherein more than one quantized unit is dispensed into the evaporator and where in all the quantized units contain the same evaporant.

4. The method according to claim 1 wherein more than one quantized unit is dispensed into the evaporator and where in at least one of the quantized units contains an evaporant different from those in the other quantized units.

5. The method according to claim 1 wherein the evaporant is dispensed along with some inert materials or an inert carrier.

6. The method according to claim 1 wherein the evaporant is in the form of a solid piece, or solid particles, or solid particles pressed into a pellet, or solid particles suspended in an inert liquid, or solid particles dispersed in a super critical CO₂, or a solution.

7. The method according to claim 1 wherein the carrier gas is preheated before being introduced into the evaporator.

8. The method according to claim 1 further including maintaining the pressure in the environment over the substrate during deposition at a sub-atmospheric pressure.

9. The method according to claim 1 wherein the evaporant is in solution and dispensed into the evaporator by an inkjet-type printhead.

10. A method of depositing multiple layers onto a substrate, comprising using the method of claim 1 for each layer.

11. The method of claim 10 wherein at least one of the quantized units contains two or more evaporants.

12. The method according to claim 10 wherein more than one quantized unit is dispensed into the evaporator and where in all the quantized units contain the same evaporant.

13. The method according to claim 10 wherein more than one quantized unit is dispensed into the evaporator and where in at least one of the quantized units contains an evaporant different from those of the other quantized units.

14. The method according to claim 10 wherein the evaporant is dispensed along with some inert materials or an inert carrier.

15. The method according to claim 10 wherein the evaporant is in the form of a solid piece, or solid particles, or solid particles pressed into a pellet, or solid particles suspended in an inert liquid, or solid particles dispersed in a super critical CO₂, or a solution.

16. The method according to claim 10 wherein the carrier gas is preheated before being introduced into the evaporator.

17. The method according to claim 10 further including maintaining the pressure in the environment over the substrate during deposition at a sub-atmospheric pressure.

18. The method according to claim 10 wherein the evaporant is in solution and dispensed into the evaporator by an inkjet-type printhead.

19. Apparatus for depositing a layer onto a substrate, comprising:

a) a platform for mounting the substrate;

b) a vapor dispenser positioned relative to the substrate platform;

c) a heated evaporator capable of completely evaporating the evaporant to be deposited;

d) a material dispenser for dispensing into the evaporator quantized units of the evaporant so as to completely vaporize such evaporant; and

e) means for introducing a flow of a carrier gas into the evaporator before, during, or after evaporation of the evaporant so as to cause a flow of the mixture of the carrier gas and the vaporized evaporant into the vapor dispenser that dispenses vaporized evaporant onto the substrate to form the layer.

20. The apparatus according to claim 19 wherein the vapor dispenser defines apertures through which the mixture is delivered onto the substrate to form the layer.