×

Process for electroless copper deposition

  • US 20070099422A1
  • Filed: 10/28/2005
  • Published: 05/03/2007
  • Est. Priority Date: 10/28/2005
  • Status: Abandoned Application
First Claim
Patent Images

1. A method for forming a copper-containing material on a substrate, comprising:

  • forming a barrier layer on a substrate;

    forming a ruthenium material on the barrier layer; and

    exposing the substrate to an electroless copper solution containing an inhibitor source to form a copper material on the ruthenium material.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×