Miniature package for translation of sensor sense axis

• US 20070101812A1
• Filed: 11/10/2005
• Published: 05/10/2007
• Est. Priority Date: 11/10/2005
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: MacGugan, Douglas
• Granted Patent: US 7,467,552 B2
• Time in Patent Office: Days
• US Class Current: 73/493
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A ceramic L-shaped or T-shaped packaging apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor die that translates the sensor sense axis perpendicular to the normal input plane for direct attachment to a system-level printed circuit board (PCB).

Claims

1. An apparatus for mounting a Micro Electro-Mechanical System (MEMS) sensor die, the apparatus comprising:

a bracket having substantially planar and mutually orthogonally oriented die attach surface plane and interface surface;

electrical signal carriers coupled between the die attach surface plane and the interface surface for routing electrical power, ground and operational signals; and

electrical interface pads positioned on the interface surface and being adapted to permit direct attachment to a printed circuit board (PCB).

2. The apparatus of claim 1 wherein the bracket further comprises a body portion and a leg portion extending from a base surface thereof, the body portion being formed with the die attach surface plane, and the leg portion being formed with the interface surface.

3. The apparatus of claim 2 wherein the leg portion is further offset relative the base surface of the body portion.

4. The apparatus of claim 3 wherein the body portion further comprises a die cavity, the die attach surface plane being formed as a floor of the die cavity.

5. The apparatus of claim 3, further comprising a plurality of electrical interface contacts adjacent to the die attach surface and coupled to the electrical signal carriers.

6. The apparatus of claim 3, further comprising a MEMS sensor die mounted on the die attach surface plane and being electrically coupled to one or more of the electrical signal carriers.

7. An apparatus for orthogonally translating an input axis of a Micro Electro-Mechanical System (MEMS) sensor, the apparatus comprising:

a bracket having a bracket body and a bracket leg extending therefrom, the bracket body and bracket leg forming respective first and second substantially planar and mutually orthogonal surfaces;

the first orthogonal surfaces formed by the bracket body further comprises a MEMS sensor die attach surface plane structured for attaching a MEMS sensor die;

the second orthogonal surface formed by the bracket leg further comprises a plurality of electrical interface contacts structured for interfacing with a host structure that is to be monitored; and

a plurality of electrical signal carriers communicating between a portion of the bracket body adjacent to the MEMS sensor mounting surface and the plurality of electrical interface contacts positioned on the interfacing surface of the bracket leg.

8. The apparatus of claim 7 wherein the bracket body further comprises a recessed die cavity.

9. The apparatus of claim 8 wherein the bracket body further comprises a plurality of electrical interface contacts adjacent to the recessed die cavity, the electrical signal carriers communicating between the electrical interface contacts and the electrical interface contacts.

10. The apparatus of claim 9 wherein the plurality of electrical interface contacts further comprises a plurality of wire-bond contacts adjacent to the recessed die cavity.

11. The apparatus of claim 10 wherein the bracket body further comprises a shelf structure adjacent to and raised relative to the recessed die cavity, the plurality of wire-bond contacts being deposited on the shelf structure.

12. The apparatus of claim 9 wherein the plurality of electrical interface contacts further comprises a plurality of flip-chip electrical interface contacts formed on the MEMS sensor die attach surface plane.

13. The apparatus of claim 9, further comprising a right angle formed between the bracket body and bracket leg.

14. The apparatus of claim 8 wherein the die cavity is further hermetically sealed.

16. The apparatus of claim 14 wherein the interface surface of bracket leg is further offset relative to a base surface of the bracket body.

17. The apparatus of claim 16 wherein the leg portion forms one of an offset T-shape and an L-shape with bracket body.

18. The apparatus of claim 17, further comprising a plurality of electrical interface contacts adjacent to die attach surface plane, the electrical interface contacts communicating with the electrical signal carriers.

19. The apparatus of claim 18 wherein the electrical interface contacts further comprise electrical interface contacts selected from the group of electrical interface contacts consisting of wire-bond contacts, solder ball contacts, and flip-chip contacts.

20. The apparatus of claim 14, further comprising a single MEMS inertial sensor die mounted on the die attach surface plane and electrically interfaced with the electrical signal carriers.

15. An apparatus for orthogonally translating an input axis of a Micro Electro-Mechanical System (MEMS) sensor, the apparatus comprising:

a substantially rigid bracket formed of a bracket body and a bracket leg extending therefrom at substantially a right angle;

.

a substantially planar die attach surface plane formed in a die cavity recessed in a first surface of the bracket body,.the die attach surface plane being structured for mounting of a single MEMS sensor die;

a substantially planar interface surface of bracket leg substantially orthogonal to die attach surface plane, the interface surface being structured for interfacing with a host printed wiring, board structure that is to be monitored; and

a plurality of electrical signal carriers communicating between the die cavity and a plurality of electrical interface pads positioned on the interface surface.