LED packaging

• US 20070102717A1
• Filed: 11/07/2005
• Published: 05/10/2007
• Est. Priority Date: 11/07/2005
• Status: Active Grant

• Current Assignee: Taiwan Oasis Technology Co., Ltd.
• Original Assignee: Taiwan Oasis Technology Co., Ltd.
• Inventors: Lee, Ming-Shun, Sung, Ping-Ru
• Granted Patent: US 7,470,935 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

Claims

1. An improved LED packaging construction has a chip embedded on a recessed carrier on substrate;

multiple conduction circuits with different electrodes being disposed to the peripheral of the carrier;

the electrode layer of chip being connected to those conduction circuits with golden plated wire;

fluorescent powders being filled in the carrier before mounting the colloid on the powder layer;

coverage of colloid extending to substrate to complete LED packaging; and

larger binding range between colloid and substrate giving better strength and increased light-emitting angle of the chip.

2. The improved LED packaging construction of claim 1, wherein the substrate is related to a plastic sheet.

3. The improved LED packaging construction of claim 1, wherein the substrate is related to a circuit board.

4. The improved LED packaging construction of claim 1, wherein a metal reflection layer is plated in the carrier.

5. The improved LED packaging construction of claim 1, wherein the fluorescent powder layer contains yellow fluorescent powders.

6. The improved LED packaging construction of claim 1, wherein the fluorescent powder layer contains yellow and green fluorescent powders.

7. The improved LED packaging construction of claim 1, wherein the packaging colloid is made in rectangular form.

8. The improved LED packaging construction of claim 1, wherein the packaging colloid is made in arc form.