Light emitting diode unit

• US 20070102722A1
• Filed: 10/30/2006
• Published: 05/10/2007
• Est. Priority Date: 11/02/2005
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Imai, Sadato, Fukasawa, Koichi, Ishizaka, Mitsunori
• Granted Patent: US 7,560,748 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.

Claims

1. A light emitting diode unit, comprising:

a base made of a material having high heat conductivity;

a printed board including a predetermined conductive pattern and an opening disposed on the base;

at least one light emitting diode chip disposed on the base within the opening of the printed board and electrically connected to the conductive pattern; and

a lens member including at least two sealing resin-injection holes which is configured to cover the light emitting diode chip and is attached to the printed board to create a space between the light emitting diode chip and the lens member.

2. The light emitting diode unit according to claim 1,

further comprising a sealing resin filling the space between the light emitting diode chip and the lens member.

3. The light emitting diode unit according to claim 1,

wherein the lens member comprises a case attached to the printed board and a lens section provided on the case,

wherein the lens member is configured to collect light emitted from the light emitting diode chip.

4. The light emitting diode unit according to claim 3,

wherein the case and the lens section of the lens member are integrally formed.

5. The light emitting diode unit according to claim 1,

wherein the base is made of anodized aluminum.

6. The light emitting diode unit according to claim 1,

wherein the base is made of an aluminum coated copper plate.

7. The light emitting diode unit according to claim 1,

wherein the light emitting diode chip is die-bonded to the base through a transparent paste.

8. The light emitting diode unit according to claim 7,

wherein the transparent paste is a silicon die-bonding paste.

9. The light emitting diode unit according to claim 1,

wherein the light emitting diode chip is die-bonded to the base through a white paste containing titanium oxide.

10. The light emitting diode unit according to claim 1,

wherein the lens member is made of a silicon resin.

11. The light emitting diode unit according to claim 10,

wherein the silicon resin is made of one selected from a rubber silicon resin and a gel-type silicon resin.

12. The light emitting diode unit according to claim 1,

wherein a fluorescent material and a diffusion material are contained in the sealing resin.

13. The light emitting diode unit according to claim 1,

wherein the lens member is attached to the printed board through a resist film.

14. The light emitting diode unit according to claim 1,

wherein a concave portion having a bottom surface and an inclined surface extending upward from a periphery of the bottom surface is provided in the base and the at least one light emitting diode is mounted on the base at the bottom surface of the concave portion.

15. The light emitting diode unit according to claim 1,

wherein a multilayer coating film to increase reflectivity is formed on the anodized aluminum surface of the base.