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MM-WAVE ANTENNA USING CONVENTIONAL IC PACKAGING

  • US 20070103380A1
  • Filed: 10/05/2006
  • Published: 05/10/2007
  • Est. Priority Date: 10/07/2005
  • Status: Active Grant
First Claim
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1. A method of forming an antenna for an integrated circuit comprising:

  • in an integrated circuit package, forming a bond to or from each integrated circuit pad that is intended to be an antenna connection, the bond formed to be elongated compared to other bonds, and arranged in an approximately perpendicular direction to the plane of the integrated circuit;

    encapsulating the top of the integrated circuit package with a dielectric material at a height grater than a desired antenna length; and

    milling the dielectric encapsulation down to a pre-selected and calibrated height, such that the elongated bond wire to/from the integrated circuit pad that is intended to be an antenna connection is severed, such that the approximately vertical bond wire to/from the integrated circuit pad that is intended to be an antenna connection forms an antenna.

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