Method of fabricating microelectromechanical system structures
First Claim
1. An anodically bonded component structure, comprising:
- at least first, second and third components anodically bonded in a predetermined order and having interfaces between adjacent said at least first, second and third components;
at least one of said first, second and third components being comprised of a glass substrate and at least one of said first, second and third components being comprised of a conductive or semiconductive material;
each of said at least first, second and third components having an upper and lower surface;
an hydrogen-free amorphous film over and in direct contact with one of said component surfaces at each interface comprising an adjacent;
glass component; and
conductive or semiconductive component; and
a sol gel with or without alkaline ions film over and in direct contact with one of said component surfaces at each interface comprising an adjacent;
conductive or semiconductive component; and
conductive or semiconductive component.
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Accused Products
Abstract
A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.
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Citations
25 Claims
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1. An anodically bonded component structure, comprising:
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at least first, second and third components anodically bonded in a predetermined order and having interfaces between adjacent said at least first, second and third components;
at least one of said first, second and third components being comprised of a glass substrate and at least one of said first, second and third components being comprised of a conductive or semiconductive material;
each of said at least first, second and third components having an upper and lower surface;
an hydrogen-free amorphous film over and in direct contact with one of said component surfaces at each interface comprising an adjacent;
glass component; and
conductive or semiconductive component; and
a sol gel with or without alkaline ions film over and in direct contact with one of said component surfaces at each interface comprising an adjacent;
conductive or semiconductive component; and
conductive or semiconductive component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An anodically bonded component structure, comprising:
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at least first, second and third components anodically bonded in a predetermined order and having interfaces between adjacent said at least first, second and third components;
at least one of said first, second and third components being comprised of a glass substrate and at least one of said first, second and third components being comprised of a conductive or semiconductive material;
each of said at least first, second and third components having an upper and lower surface;
an hydrogen-free amorphous film, comprised of silicon, silicon oxide or silicon nitride, over and in direct contact with one of said component surfaces at each interface comprising an adjacent;
glass component; and
conductive or semiconductive component; and
a sol gel with or without alkaline ions film over and in direct contact with one of said component surfaces at each interface comprising an adjacent;
conductive or semiconductive component; and
conductive or semiconductive component. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A bonded component structure, comprising:
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at least first, second and third components anodically bonded in a predetermined order and having interfaces between adjacent said at least first, second and third components;
at least one of said first, second and third components being comprised of a glass substrate and at least one of said first, second and third components being comprised of a conductive or semiconductive material;
each of said at least first, second and third components having an upper and lower surface;
an hydrogen-free amorphous film over and in direct contact with one of the component surfaces at each interface comprising an adjacent;
glass component; and
conductive or semiconductive component; and
a sol gel with or without alkaline ions film over and in direct contact with one of the component surfaces at each interface comprising an adjacent;
conductive or semiconductive component; and
conductive or semiconductive component. - View Dependent Claims (24, 25)
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Specification