Method and system for high volume transfer of dies to substrates

• US 20070107186A1
• Filed: 11/04/2005
• Published: 05/17/2007
• Est. Priority Date: 11/04/2005
• Status: Abandoned Application

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Addison, David, Steinmetz, Travis
• Application Number:
  US11/266,208
• Publication Number:
  US 20070107186A1
• Time in Patent Office: Days
• US Class Current: 29/428
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2224/10 Bump connectors; Manufacturing methods related thereto
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A method, system, and apparatus for transferring dies to respective substrates is described. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously or consecutively. Dies are loaded in a channel of a die application device. The dies are moved through the channel using any of a variety of means, such as gravity, air, vibration, a brush, a spring, etc. The die application device dispenses the dies onto respective substrates. In an aspect, the die application device independently dispenses each of the dies. In another aspect, the die application device dispenses multiple dies at a time.

Claims

1. A method of transferring dies to respective substrates, comprising:

loading a plurality of dies in a channel of a die application device; and

dispensing the dies onto respective substrates.

2. The method of claim 1, further comprising:

moving the plurality of dies through the channel to align at least one die of the plurality of dies with a surface of a die application element of the die application device.

3. The method of claim 2, wherein moving the plurality of dies includes pushing the dies with air.

4. The method of claim 2, wherein moving the plurality of dies is performed using a vacuum.

5. The method of claim 2, wherein moving the plurality of dies includes vibrating the plurality of dies.

6. The method of claim 2, wherein moving the plurality of dies includes carrying the plurality of dies on a guide of the die application device toward a die application element of the die application device.

7. The method of claim 2, wherein moving the plurality of dies is performed using a spring.

8. The method of claim 2, wherein moving the plurality of dies is performed using a brush.

9. The method of claim 1, wherein dispensing the dies includes independently dispensing each die of the plurality of dies.

10. The method of claim 1, wherein dispensing the dies includes actuating a die application element of the die application device using a servo-controlled linear drive.

11. The method of claim 1, wherein dispensing the dies includes actuating a die application element of the die application device using an electromechanical solenoid.

12. The method of claim 1, further comprising:

tacking the dies onto the respective substrates using pressure.

13. The method of claim 1, further comprising:

bonding the dies onto the respective substrates using pressure and heat.

14. An apparatus to transfer dies to respective substrates, comprising:

a body having a channel that is configured to receive a plurality of dies; and

a die application element that is configured to transfer dies of the plurality of dies to respective substrates.

15. The apparatus of claim 14, further comprising a guide coupled to the body, wherein a combination of the guide and the body laterally surrounds at least a portion of the channel.

16. The apparatus of claim 15, wherein the body and the guide are a unitary element.

17. The apparatus of claim 14, wherein the die application element is provided in an opening of the body.

18. The apparatus of claim 14, wherein the die application element is configured to move along an axis that is substantially perpendicular to an axis of the channel.

19. The apparatus of claim 14, wherein the die application element is configured to move along a first axis and the channel is configured along a second axis, and wherein the first axis and the second axis are configured at an angle that enables gravity to facilitate movement of the plurality of dies toward die application element.

20. The apparatus of claim 14, wherein the die application element is configured to transfer a single die at a time.

21. The apparatus of claim 14, wherein the die application element is configured to transfer multiple dies at a time.

22. The apparatus of claim 14, further comprising:

a second die application element that is configured to transfer dies of a second plurality of dies to respective substrates, wherein the body further has a second channel that is configured to receive the second plurality of dies.