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SEMICONDUCTOR PROCESSING SYSTEM

  • US 20070107845A1
  • Filed: 01/16/2007
  • Published: 05/17/2007
  • Est. Priority Date: 08/14/2001
  • Status: Abandoned Application
First Claim
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1. A semiconductor processing system comprising:

  • an entrance transfer chamber with an atmospheric pressure atmosphere set inside;

    a common transfer chamber with a vacuum atmosphere set inside, which is connected to the entrance transfer chamber through an intermediate structure that forms a route for transferring a target substrate;

    a plurality of vacuum processing apparatuses connected to the common transfer chamber, each of which is configured to perform a predetermined process on the target substrate within a vacuum atmosphere;

    a first transfer arm device disposed in the entrance transfer chamber and configured to transfer the target substrate to and from the intermediate structure; and

    a second transfer arm device disposed in the common transfer chamber and configured to transfer the target substrate between the intermediate structure and the vacuum processing apparatuses, wherein the intermediate structure comprises a transfer passage that connects the entrance transfer chamber and the common transfer chamber to allow the target substrate to pass therein, and includes a first buffer chamber, a middle transfer chamber, and a second buffer chamber connected in series in this order, such that the first and second buffer chambers are connected to the entrance transfer chamber and the common transfer chamber, respectively, wherein each of the first and second buffer chambers is connected to a gas supply system and a vacuum exhaust system, and at least one of the first and second buffer chambers is provided with gate valves respectively disposed on both sides and is configured to adjust inner pressure between atmospheric pressure and vacuum, an additional processing apparatus connected to the middle transfer chamber, and a third transfer arm device disposed in the middle transfer chamber and configured to transfer the target substrate between the first buffer chamber, the additional) processing apparatus, and the second buffer chamber.

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