Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

• US 20070108631A1
• Filed: 11/13/2006
• Published: 05/17/2007
• Est. Priority Date: 11/14/2005
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Ishizaka, Hitoshi, Nakamura, Kei
• Granted Patent: US 7,561,434 B2
• Time in Patent Office: Days
• US Class Current: 257/784
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H05K 1/0269 : for visual or optical inspection
• CPC Class Codes: H05K 1/056 : the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0108 : Transparent
• CPC Class Codes: H05K 2201/0969 : Apertured conductors
• CPC Class Codes: H05K 2201/09918 : Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2203/166 : Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

Claims

1. A wired circuit board comprising:

a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45° and

having an opening formed therein;

an insulating layer formed on the metal supporting layer, and including a mounting portion which is exposed from the opening and having a haze value of 20 to 50%; and

a conductive pattern formed on the insulating layer.

2. A method for manufacturing a wired circuit board and mounting an electronic component thereon, the method comprising the steps of:

preparing a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°

;

forming an insulating layer including a mounting portion on the metal supporting layer;

forming a conductive pattern on the insulating layer;

placing an optical sensor so as to reflect a sensing light at the conductive pattern and inspecting a defective shape of the conductive pattern by the optical sensor;

etching a portion of the metal supporting layer which is overlapping the mounting portion to form an opening such that the insulating layer of the mounting portion exposed by etching has a haze value of 20 to 50%; and

placing an optical sensor to allow transmission of the sensing light through the insulating layer of the mounting portion, aligning the electronic component with the mounting portion by using the optical sensor, and mounting the electronic component on the mounting portion.