TRENCH INSULATION STRUCTURES AND METHODS
First Claim
1. A method of forming an isolation structure comprising:
- forming a recess within a substrate;
depositing an insulating liner within the recess;
exposing the recess to a plasma process after depositing the insulating liner to form a silicon rich layer at a base of the recess;
depositing a spin-on deposition (SOD) precursor after exposing the recess to the plasma process; and
converting the SOD precursor to an insulating layer, wherein converting the SOD precursor includes expanding the silicon rich layer.
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Accused Products
Abstract
A method of depositing dielectric material into sub-micron spaces and resultant structures is provided. After a trench is etched in the surface of a wafer, a liner layer preferably is deposited into the trench. An anisotropic plasma process is then performed on the trench. A silicon layer may be deposited on the base of the trench during the plasma process, or the plasma can treat the liner layer. The trench is then filled with a spin-on precursor. A densification or reaction process is then applied to convert the spin-on material into an insulator, and oxidizing the silicon rich layer on the base of the trench. The resulting trench has a consistent etch rate from top to bottom of the trench.
355 Citations
24 Claims
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1. A method of forming an isolation structure comprising:
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forming a recess within a substrate;
depositing an insulating liner within the recess;
exposing the recess to a plasma process after depositing the insulating liner to form a silicon rich layer at a base of the recess;
depositing a spin-on deposition (SOD) precursor after exposing the recess to the plasma process; and
converting the SOD precursor to an insulating layer, wherein converting the SOD precursor includes expanding the silicon rich layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a computer memory device comprising:
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forming a trench in a substrate;
anisotropically depositing a silicon-based layer along a base of the trench;
depositing an insulator material into the trench after depositing the silicon-based layer; and
converting the silicon-based layer at least partially into silicon oxide during or after depositing the insulator material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of improving density of a spin-on dielectric comprising:
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providing a liner within a recess in a substrate;
depositing silicon on at least part of the liner using a primarily anisotropic plasma deposition process; and
depositing a spin-on deposition (SOD) dielectric precursor within the liner. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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Specification