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Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof

  • US 20070111539A1
  • Filed: 04/03/2006
  • Published: 05/17/2007
  • Est. Priority Date: 11/14/2005
  • Status: Active Grant
First Claim
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1. A material for forming an adhesion reinforcing layer comprising any one of organoalkoxysilane having a basic functional group, a basic additive and organoalkoxysilane.

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