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Buffered Thin Module System and Method

  • US 20070111606A1
  • Filed: 11/28/2006
  • Published: 05/17/2007
  • Est. Priority Date: 09/03/2004
  • Status: Abandoned Application
First Claim
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1. A circuit module comprising:

  • a first side and a second side, between which is disposed a substrate having a first perimeter edge and a second perimeter edge;

    a plurality of module contacts comprising a first row of contacts disposed along the first side of the circuit module proximal to the first perimeter edge of the substrate and a second row of contacts disposed along the second side of the circuit module proximal to the first perimeter edge of the substrate;

    a first FB-DIMM circuit comprising a first memory device and a first AMB, the first FB-DIMM circuit connected by first conductive traces to first selected ones of the plurality of module contacts; and

    a second FB-DIMM circuit comprising a second memory device and a second AMB the second FB-DIMM circuit connected by second conductive traces to second selected ones of the plurality of module contacts.

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