PROCESS FOR FORMING AT LEAST A PORTION OF A PACKAGE OR AN ENVELOPE BEARING A PRINTED INDICIA

• US 20070113966A1
• Filed: 09/18/2006
• Published: 05/24/2007
• Est. Priority Date: 02/23/2004
• Status: Active Grant

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Cote, Andre, Eckstein, Eric
• Granted Patent: US 7,856,708 B2
• Time in Patent Office: Days
• US Class Current: 156/267
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1041 Subsequent to lamination
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 156/1077 Applying plural cut laminae to single face of additional lamina
• CPC Class Codes: Y10T 156/108 Flash, trim or excess removal
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/1089 of discrete laminae to single face of additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths

Abstract

A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.

Claims

1. A process for forming at least a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia, said process comprising:

(A) providing a substrate which constitutes a portion of said package, label or sheet to a printing apparatus, and

(B) utilizing said printing apparatus or an adjunct to said printing apparatus cooperatively located with respect to said printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on said substrate substantially contemporaneously with the printing of said indicia on said substrate.

2. The process of claim 1 wherein said forming of said at least one electrically conductive component on said substrate is accomplished slightly prior to the printing of said indicia on said substrate.

3. The process of claim 1 wherein said forming of said at least one electrically conductive component on said substrate is accomplished slightly after the printing of said indicia on said substrate.

4. The process of claim 1 wherein said forming of said at least one electrically conductive component on said substrate is accomplished at the same time as the printing of said indicia on said substrate.

5. The process of claim 1 wherein said formation of said at least one electrically conductive component on said substrate is accomplished by:

(C) applying an adhesive to said substrate in a pattern desired for said at least one electrically conductive component,

(D) applying an electrically conductive layer to said adhesive pattern to cause portions of said electrically conductive layer to be secured to said adhesive pattern, and

(E) removing those portions of said electrically conductive layer that are not secured to said adhesive pattern.

6. The process of claim 5 comprising die-cutting said electrically conductive layer about the periphery of the portions of said electrically conductive layer that are secured to said adhesive pattern prior to removing those portions of said electrically conductive layer that are not secured to said adhesive pattern.

7. The process of claim 1 wherein said at least one electrically conductive component of an EAS or RFID tag comprises a coil or a portion of a coil.

8. The process of claim 1 wherein said at least one electrically conductive component of an EAS or RFID tag comprises an antenna or a portion of an antenna.

9. The process of claim 1 wherein said at least one electrically conductive component of an EAS or RFID tag comprises a plate of a capacitor or a portion of a plate of a capacitor.