PACKAGE AND ELECTRONIC APPARATUS USING THE SAME

• US 20070114620A1
• Filed: 09/11/2006
• Published: 05/24/2007
• Est. Priority Date: 11/24/2005
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Fujii, Yoshio, Yokoyama, Yoshinori, Fukumoto, Hiroshi, Ogawa, Shinpei
• Granted Patent: US 7,605,467 B2
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 2203/1147 Sealing or impregnating, e.g. of pores
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ring. Further, an upper connection pad and a lower connection pad are adhered by connecting solder. The width of a tip end of a connection projection is narrower than the width of lower connection pad. Therefore, the connecting solder is placed on the lower connection pad and on the side surface of upper connection pad. Thus, a package is provided, which attains satisfactory electrical connection and hermetic seal after solder joint of the upper and lower substrates.

Claims

1. A package, comprising:

a lower substrate;

an upper substrate including a ring-shaped sealing projection and attached to said lower substrate so as to form a sealed space with said lower substrate;

a lower sealing ring provided so as to surround a prescribed region at a position corresponding to said sealing projection on said lower substrate and being greater in width than a tip end of said sealing projection;

an upper sealing ring provided on a surface of said sealing projection;

a sealing solder portion positioned on said lower sealing ring and on a side surface of said upper sealing ring so that said upper sealing ring and said lower sealing ring are joined to each other.

2. An electronic apparatus having an electronic component provided in the space between said upper substrate and said lower substrate of the package according to claim 1.

3. A package, comprising:

a lower substrate;

an upper substrate including a connection projection and attached to said lower substrate;

a lower connection pad provided at a position corresponding to said connection projection on said lower substrate and being greater in width than a tip end of said connection projection;

an upper connection pad provided on a surface of said connection projection;

a connecting solder portion positioned on said lower connection pad and on a side surface of said upper connection pad so that said upper connection pad and said lower connection pad are joined to each other.

4. The package according to claim 3, wherein

a side surface of said connection projection is an inclined surface inclined with respect to a main surface of said upper substrate.

5. The package according to claim 3, wherein

a side surface of said connection projection is a vertical surface extending approximately vertical to a main surface of said upper substrate.

6. The package according to claim 3, wherein

said upper substrate has a through hole extending in a depth direction;

a through interconnection is formed in said through hole; and

said through interconnection has one end electrically connected to said upper connection pad and the other end connectable to an external device.

7. The package according to claim 6, wherein

said through interconnection extends in and through said connection projection.

8. An electronic apparatus having an electronic component provided in a space between said upper substrate and said lower substrate of the package according to claim 3.

9. A package, comprising:

a lower substrate;

an upper substrate including a ring-shaped sealing projection and a connection projection and attached to said lower substrate so as to form a sealed space with said lower substrate;

a lower sealing ring provided so as to surround a prescribed region at a position corresponding to said sealing projection on said lower substrate and being greater in width than a tip end of said sealing projection;

an upper sealing ring provided on a surface of said sealing projection;

a sealing solder portion positioned on said lower sealing ring and on a side surface of said sealing ring so that said upper sealing ring and said lower sealing ring are joined to each other;

a lower connection pad provided at a position corresponding to said connection projection on said lower substrate and being greater in width than a tip end of said connection projection;

an upper connection pad provided on a surface of said connection projection;

a connecting solder portion positioned on said lower connection pad and on a side surface of said upper connection pad so that said upper connection pad and said lower connection pad are joined to each other.

10. The package according to claim 9, wherein

a side surface of said connection projection is an inclined surface inclined with respect to a main surface of said upper substrate.

11. The package according to claim 9, wherein

a side surface of said connection projection is a vertical surface extending approximately vertical to a main surface of said upper substrate.

12. The package according to claim 9, wherein

said upper substrate has a through hole extending in a depth direction;

a through interconnection is formed in said through hole; and

said through interconnection has one end electrically connected to said upper connection pad and the other end connectable to an external device.

13. The package according to claim 12, wherein

said through interconnection extends in and through said connection projection.

14. An electronic apparatus having an electronic component provided in the space between said upper substrate and said lower substrate of the package according to claim 9.