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Chip level packaging for wireless surface acoustic wave sensor

  • US 20070114889A1
  • Filed: 11/21/2005
  • Published: 05/24/2007
  • Est. Priority Date: 11/21/2005
  • Status: Abandoned Application
First Claim
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1. A sensor packaging system, comprising:

  • a plastic substrate configured to include a gap for receiving and maintaining an acoustic wave sensor; and

    an antenna printed on said plastic substrate and connected electrically to said acoustic wave sensor for the transmission and receipt of data from and to said acoustic wave sensor.

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