Chip level packaging for wireless surface acoustic wave sensor

• US 20070114889A1
• Filed: 11/21/2005
• Published: 05/24/2007
• Est. Priority Date: 11/21/2005
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Cobianu, Cornel, Georgescu, Ion, Buiculescu, Vlad
• Application Number:
  US11/286,064
• Publication Number:
  US 20070114889A1
• Time in Patent Office: Days
• US Class Current: 310/338
• CPC Class Codes: B60C 23/0408 transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
• CPC Class Codes: G01L 19/086 for remote indication
• CPC Class Codes: G01L 9/0025 with acoustic surface waves
• CPC Class Codes: G06K 19/067 Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
• CPC Class Codes: G06K 19/0675 the resonating marks being of the surface acoustic wave [SAW] kind SAW devices per se H03H9/64

Abstract

A sensor packaging system and methodology includes a plastic substrate configured to include a gap for receiving and maintaining an acoustic wave sensor. An antenna can be printed directly on the plastic substrate and connected electrically to the acoustic wave sensor for the transmission and receipt of data from and to the acoustic wave sensor. The antenna can be flip chip mounted to the acoustic wave sensor, which can be implemented, for example, in the context of a Surface Acoustic Wave (SAW) sensor chip. Such a SAW sensor chip can includes a plurality of metal electrodes located on the same surface of the plastic substrate as the SAW sensor chip.

Claims

1. A sensor packaging system, comprising:

a plastic substrate configured to include a gap for receiving and maintaining an acoustic wave sensor; and

an antenna printed on said plastic substrate and connected electrically to said acoustic wave sensor for the transmission and receipt of data from and to said acoustic wave sensor.

2. The system of claim 1 wherein said antenna is flip chip surface mounted to said acoustic wave sensor.

3. The system of claim 1 wherein said acoustic wave sensor comprises a Surface Acoustic Wave (SAW) sensor chip comprising at least two quartz parts bonded to one another.

4. The system of claim 3 wherein said SAW sensor chip comprises a plurality of metal electrodes located on a same surface of a quartz substrate as said SAW sensor chip.

5. The system of claim 3 wherein an insulating polyimide selectively encapsulates at least one surface of said SAW sensor chip.

6. The system of claim 3 further comprising a sensing diaphragm maintained by said SAW sensor chip.

7. The system of claim 6 wherein said sensing diaphragm comprises a recessed area and wherein a gel that functions as a pressure transmitting element is located within said recessed area.

8. The system of claim 1 wherein said plastic substrate comprises a dielectric substrate.

9. The system of claim 8 wherein said dielectric substrate comprises a flexible substrate.

10. The system of claim 1 wherein said acoustic wave sensor comprises a quartz cover and wherein said gap formed in said plastic substrate accommodates said quartz cover.

11. The system of claim 1 wherein said antenna is printed directly on said plastic substrate by maskless ink-jet deposition.

12. The system of claim 1 wherein said acoustic wave sensor is mounted on said antenna with a plurality of bonding pads associated with said acoustic wave sensor positioned on a plurality of corresponding bonding pads associated with said antenna.

13. A sensor packaging system, comprising:

a dielectric substrate;

a wireless acoustic wave sensor comprising at least one quartz component; and

an antenna attached to said wireless acoustic wave sensor on said dielectric substrate utilizing ink-jet maskless printing, thereby providing a sensor for the wireless transmission and receipt of sensor data.

14. The system of claim 13 wherein said antenna printed on said dielectric substrate operates in a frequency range of approximately 100 KHz to 2.4 GHz.

15. The system of claim 13 wherein said dielectric substrate comprises a hole for maintaining said wireless acoustic wave sensor, wherein said hole is configured so that a cover associated with said wireless acoustic wave sensor can be accommodated therein for a decreased total thickness of said acoustic wave sensor.

16. The system of claim 13 further comprising a sensing diaphragm maintained by said wireless acoustic wave sensor, wherein said sensing diagram comprises a recessed area wherein a gel can be located that functions as a sensing element.

17. A sensor packaging method, comprising:

providing a dielectric substrate;

configuring a wireless acoustic wave sensor to comprise at least one quartz component, wherein said wireless acoustic wave sensor is connected to said dielectric substrate;

attaching an antenna to said wireless acoustic wave sensor on said dielectric substrate utilizing ink-jet maskless printing, thereby providing a sensor for the wireless transmission and receipt of sensor data.

18. The method of claim 17 further comprising:

configuring said dielectric substrate to include a hole for maintaining said wireless acoustic wave sensor; and

shaping said hole so that a cover associated with said wireless acoustic wave sensor can be accommodated therein for a decreased total thickness of said acoustic wave sensor.

19. The method of claim 18 further comprising:

providing a sensing diaphragm that is maintained by said wireless acoustic wave sensor; and

configuring said sensing diagram to include a recessed area; and

locating a gel with said recessed area, wherein said gel that functions as a sensing element.

20. The method of claim 18 further comprising:

providing said wireless acoustic wave sensor as a Surface Acoustic Wave (SAW) sensor chip;

configuring said SAW sensor chip to comprise a plurality of metal electrodes located on a same surface of a quartz substrate as said SAW sensor chip; and

providing an insulating polyimide that selectively encapsulates at least one surface of said SAW sensor chip.