Apparatus for thermal and plasma enhanced vapor deposition and method of operating
First Claim
1. A deposition system for forming a deposit on a substrate comprising:
- a first assembly having a process space configured to facilitate material deposition;
a second assembly coupled to said first assembly and having a transfer space to facilitate transfer of said substrate into and out of said deposition system;
a substrate stage connected to said second assembly and configured to support said substrate;
a sealing member configured to separate the process space from the transfer space;
wherein the first assembly is configured to be maintained at a first temperature and the second assembly is configured to be maintained at a reduced temperature lower than the first temperature.
1 Assignment
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Accused Products
Abstract
A method, computer readable medium, and system for vapor deposition on a substrate that maintain a first assembly of the vapor deposition system at a first temperature, maintain a second assembly of the vapor deposition system at a reduced temperature lower than the first temperature, dispose the substrate in a process space of the first assembly that is vacuum isolated from a transfer space in the second assembly, and deposit a material on the substrate. As such, the system includes a first assembly having a process space configured to facilitate material deposition, a second assembly coupled to the first assembly and having a transfer space to facilitate transfer of the substrate into and out of the deposition system, a substrate stage connected to the second assembly and configured to support the substrate, and a sealing assembly configured to separate the process space from the transfer space. The first assembly is configured to be maintained at a first temperature and the second assembly is configured to be maintained at a reduced temperature lower than the first temperature.
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Citations
39 Claims
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1. A deposition system for forming a deposit on a substrate comprising:
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a first assembly having a process space configured to facilitate material deposition;
a second assembly coupled to said first assembly and having a transfer space to facilitate transfer of said substrate into and out of said deposition system;
a substrate stage connected to said second assembly and configured to support said substrate;
a sealing member configured to separate the process space from the transfer space;
wherein the first assembly is configured to be maintained at a first temperature and the second assembly is configured to be maintained at a reduced temperature lower than the first temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for material deposition on a substrate in a vapor deposition system, comprising:
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maintaining a first assembly of the vapor deposition system at a first temperature;
maintaining a second assembly of the vapor deposition system at a reduced temperature lower than the first temperature;
disposing said substrate in a process space of the first assembly that is vacuum isolated from a transfer space in the second assembly; and
depositing a material on said substrate. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification