Apparatus for thermal and plasma enhanced vapor deposition and method of operating

• US 20070116873A1
• Filed: 11/18/2005
• Published: 05/24/2007
• Est. Priority Date: 11/18/2005
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Gomi, Atsushi, Ishizaka, Tadahiro, Faguet, Jacques, Hara, Masamichi, Mizusawa, Yasushi, Fujisato, Toshiaki, Li, Yicheng, Yamamoto, Kaoru
• Application Number:
  US11/281,376
• Publication Number:
  US 20070116873A1
• Time in Patent Office: Days
• US Class Current: 427/248.100
• CPC Class Codes: C23C 16/4401 Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• CPC Class Codes: C23C 16/4412 Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
• CPC Class Codes: C23C 16/45517 Confinement of gases to vicinity of substrate
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32495 Means for protecting the vessel against plasma
• CPC Class Codes: H01J 37/32522 Temperature

Abstract

A method, computer readable medium, and system for vapor deposition on a substrate that maintain a first assembly of the vapor deposition system at a first temperature, maintain a second assembly of the vapor deposition system at a reduced temperature lower than the first temperature, dispose the substrate in a process space of the first assembly that is vacuum isolated from a transfer space in the second assembly, and deposit a material on the substrate. As such, the system includes a first assembly having a process space configured to facilitate material deposition, a second assembly coupled to the first assembly and having a transfer space to facilitate transfer of the substrate into and out of the deposition system, a substrate stage connected to the second assembly and configured to support the substrate, and a sealing assembly configured to separate the process space from the transfer space. The first assembly is configured to be maintained at a first temperature and the second assembly is configured to be maintained at a reduced temperature lower than the first temperature.

Claims

1. A deposition system for forming a deposit on a substrate comprising:

a first assembly having a process space configured to facilitate material deposition;

a second assembly coupled to said first assembly and having a transfer space to facilitate transfer of said substrate into and out of said deposition system;

a substrate stage connected to said second assembly and configured to support said substrate;

a sealing member configured to separate the process space from the transfer space;

wherein the first assembly is configured to be maintained at a first temperature and the second assembly is configured to be maintained at a reduced temperature lower than the first temperature.

2. The deposition system of claim 1, wherein said first assembly is configured to be maintained at said first temperature greater than or equal to 100 degrees C. during processing, and said second assembly is configured to be maintained at said second temperature less than 100 degrees C.

3. The deposition system of claim 1, wherein said first assembly is configured to be maintained at said first temperature greater than or equal to 50 degrees C. during processing, and said second assembly is configured to be maintained at said second temperature less than 50 degrees C.

4. The deposition system of claim 1, further comprising:

a coolant channel inside a body of the first assembly proximate a junction between the first assembly and the second assembly.

5. The deposition system of claim 1, further comprising:

a coolant channel inside a body of the second assembly proximate a junction between the first assembly and the second assembly.

6. The deposition system of claim 1, wherein:

the first assembly comprises an aluminum or aluminum alloy material;

the second assembly comprises an aluminum or aluminum alloy material; and

the second assembly is joined to the first assembly by a stainless steel component.

7. The deposition system of claim 1, wherein said sealing assembly comprises a seal to vacuum isolate the process space from the transfer space.

8. The system of claim 7, wherein the seal is configured to reduce gas leakage from the process space to the transfer space to less than 10⁻

3 Torr-l/s.

9. The system of claim 7, wherein the seal is configured to reduce gas leakage from the process space to the transfer space to less than 10⁻

4 Torr-l/s.

10. The deposition system of claim 1, further comprising:

a first pressure control system coupled to said first assembly and configured to evacuate said process space during processing;

a second pressure control system coupled to said second assembly and configured to provide a reduced contaminant environment in said transfer space;

a gas injection system connected to said first assembly, and configured to introduce a process composition to said process space during said material deposition; and

a temperature control system coupled to said substrate stage, and configured to control a temperature of said substrate.

11. The deposition system of claim 1, wherein:

the first assembly comprises an upper section of the deposition system and the second assembly comprises a lower section of the deposition system; and

the substrate stage is configured to translate said substrate in a vertical direction.

12. The deposition system of claim 1, further comprising:

a power source configured to couple power to a process gas composition in said process space to facilitate plasma formation.

13. The deposition system of claim 1, wherein:

the power source comprises an RF power supply configured to output an RF energy at a frequency from 0.1 to 100 MHz; and

the substrate stage includes an electrode connected to the RF power supply and configured to couple said RF energy into the process space.

14. The deposition system of claim 1, wherein said first assembly comprises:

an extension extending from the first assembly for separation of the process space from the transfer space.

15. The deposition system of claim 14, wherein the extension is configured as a radiation shield between the first assembly and the second assembly.

16. The deposition system of claim 14, wherein the extension includes an interior channel providing gas conductance from a first side of the extension near the substrate stage to a second side positioned longitudinally at an end of the extension opposite the first side.

17. The deposition system of claim 16, wherein the extension comprises a thermal impedance to heat flow from the process space to the transfer space.

18. The deposition system of claim 1, wherein said process space is configured for at least one of atomic layer deposition (ALD) or chemical vapor deposition (CVD).

19. The deposition system of claim 1, further comprising:

a controller configured to control a process in the process chamber.

20. The deposition system of claim 19, wherein the controller is programmed to:

maintain a first assembly of the vapor deposition system at a first temperature;

maintain a second assembly of the vapor deposition system at a reduced temperature lower than the first temperature;

dispose said substrate in the process space; and

deposit a material on said substrate.

21. A method for material deposition on a substrate in a vapor deposition system, comprising:

maintaining a first assembly of the vapor deposition system at a first temperature;

maintaining a second assembly of the vapor deposition system at a reduced temperature lower than the first temperature;

disposing said substrate in a process space of the first assembly that is vacuum isolated from a transfer space in the second assembly; and

depositing a material on said substrate.

22. The method of claim 21, further comprising:

maintaining said first assembly greater than or equal to 100 degrees C., and

maintaining said second assembly less than 100 degrees C.

23. The method of claim 21, further comprising:

maintaining said first assembly greater than or equal to 50 degrees C., and

maintaining said second assembly less than 50 degrees C.

24. The method of claim 21, wherein said depositing a material comprises:

introducing a process gas composition to said process space for vapor deposition.

25. The method of claim 21, wherein said depositing a material comprises:

introducing a process gas composition to said process space for plasma enhanced vapor deposition; and

forming a plasma from the process gas composition.

26. The method of claim 21, wherein said depositing a material comprises:

depositing at least one of a tantalum film, a tantalum carbide film, a tantalum nitride film, or a tantalum carbonitride film.

27. The method of claim 21, wherein said depositing a material comprises:

depositing at least one of a metal, a metal carbide film, a metal oxide, a metal nitride, a metal carbonitride, or a metal silicide, or a combination of any one of these films.

28. The method of claim 21, wherein said disposing comprises disposing said substrate in a chamber configured to perform at least one of an atomic layer deposition (ALD) process, a plasma enhanced ALD process, a chemical vapor deposition (CVD) process, or a plasma enhanced CVD (PECVD) process.

29. The method of claim 28, wherein said depositing a material comprises:

depositing a first film using said ALD process; and

depositing a second film using said PECVD or said PEALD process.

30. The method of claim 28, wherein said depositing a material comprises:

depositing a first film using said CVD process; and

depositing a second film using said PECVD or said PEALD process.

31. The method of claim 28, wherein said depositing a material comprises:

depositing a first film using said ALD process; and

depositing a second film using said CVD process.

32. The method of claim 21, wherein the depositing a material comprises:

applying RF energy at a frequency from 0.1 to 100 MHz to a process gas in the process space.

33. The method of claim 21, further comprising:

introducing a purge gas after said depositing a material.

34. The method of claim 21, further comprising:

translating a substrate stage to a position that improves a uniformity of the deposited material.

35. The method of claim 21, wherein the depositing a material comprises:

setting a position of a substrate stage holding the substrate to a position in which a plasma uniformity in the process space is to be better than 2% across a 300 mm diameter of the substrate stage; and

forming plasma for material deposition on the substrate.

36. The method of claim 35, wherein said setting comprises:

setting the substrate stage to a position in which the plasma uniformity is to be better than 1% across a 300 mm diameter of the substrate stage.

37. The method of claim 21, wherein said disposing said substrate comprises:

disposing the substrate in a process chamber having a gas leakage from the process space to the transfer space of less than 10<sup>−

3</sup> Torr-l/s.

38. The method of claim 21, wherein said disposing said substrate comprises:

disposing the substrate in a process chamber having a gas leakage from the process space to the transfer space of less than 10<sup>−

4</sup> Torr-l/s.

39. A computer readable medium containing program instructions for execution on a substrate processing system processor, which when executed by the processor, cause the substrate processing system to perform the any one of the steps recited in claims 21-38.