Apparatus incorporating small-feature-size and large-feature-size components and method for making same

• US 20070117274A1
• Filed: 01/16/2007
• Published: 05/24/2007
• Est. Priority Date: 01/23/2002
• Status: Abandoned Application

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Inventors: Hadley, Mark, Drzaic, Paul, Tootoochi, Aly, Craig, Gordon, Swindlehurst, Susan, Gengel, Glenn, Herrmann, Scott, Eisenhardt, Randolph
• Application Number:
  US11/654,312
• Publication Number:
  US 20070117274A1
• Time in Patent Office: Days
• US Class Current: 438/125
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13019 at the bonding interface of the bump connector, i.e. on the surface of the bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13499 Shape or distribution of the fillers
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 : Base material
• CPC Class Codes: H01L 2224/293 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29339 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/73104 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/76155 : Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/81207 : Thermosonic bonding
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/81898 : Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
• CPC Class Codes: H01L 2224/81903 : by means of a layer connector
• CPC Class Codes: H01L 2224/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 : using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/838 : Bonding techniques
• CPC Class Codes: H01L 2224/83865 : Microwave curing
• CPC Class Codes: H01L 2224/83868 : Infrared [IR] curing
• CPC Class Codes: H01L 2224/83871 : Visible light curing
• CPC Class Codes: H01L 2224/83874 : Ultraviolet [UV] curing
• CPC Class Codes: H01L 2224/95085 : being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/90 : Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

Claims

1. A method comprising:

attaching a first conductor formed on top of a first substrate containing a functional block to a second conductor of a large-scale component, the functional block being attached to a first substrate and being electrically connected to the first conductor, and the large-scale component being formed on a second substrate;

the first conductor being interconnected to the second conductor by an anisotropic conductive medium using one of thermosonic bonding and thermocompression bonding;

each of the first conductor and the second conductor being independently made out of any one of a metal, a thermoplastic material, and a thermosetting material.

2. The method of claim 1 wherein any one of or both of the thermoplastic material and the thermosetting material is inherently conductive.

3. The method of claim 1 further comprises dispensing a plurality of small and sharp particles into the material used to make one of the first conductor and the second conductor to create a mechanical interlock to enhance the attachment between the first conductor and the second conductor.

4. A method comprising:

attaching a first conductor being made of a thermoplastic or a thermosetting material to an integrated circuit disposed on a first substrate, the first conductor electrically connected to the integrated circuit, the first conductor being formed on a top surface of the first substrate, wherein an anisotropic conductive medium is attached to the first conductor; and

attaching a large-scale component to the first conductor, the large-scale component electrically connected to the first conductor, and the large-scale component formed on a second substrate.

5. The method of claim 4, wherein attaching the first conductor to the integrated circuit is accomplished by any one of screen printing, flatbed and rotary screen printing, stencil printing, ink jet printing, gravure printing, flexographic printing, pad stamping, electrostatic printing, dispensing through a needle and pipette, laminating, hot pressing, laser assisted chemical vapor deposition, physical vapor deposition, shadow masking, evaporating, extrusion coating, curtain coating, and electroplating.

6. The method of claim 4 further comprises attaching the anisotropic conductive medium to a second conductor included with the large-scale component to interconnect the integrated circuit to the large-scale component.

7. The method of claim 6 further comprises using one of thermosonic bonding and thermocompression bonding to facilitate the attaching of the conductive medium to any one of the first conductor and the second conductor.

8. A method comprising:

incorporating an integrated circuit onto a first substrate and disposing a first conductor on a top surface of the first substrate, the integrated circuit electrically connected to the first conductor, the first conductor being made of a thermosetting material or a thermoplastic material; and

electrically coupling a large-scale component having a second conductor to the integrated circuit, the second conductor being electrically coupled to the first conductor via an anisotropic conductive medium to electrically couple the large-scale component to the integrated circuit, the large-scale component including a second substrate.

9. The method of claim 8 wherein any one or both of the thermoplastic material and the thermosetting material is inherently conductive.

10. The method of claim 8 further comprises coupling the second conductor directly to the first conductor wherein an active surface of the integrated circuit faces the second conductor.

11. The method of claim 8 wherein an active surface of the integrated circuit faces the second conductor.

12. The method of claim 8 wherein the thermosetting material or the thermoplastic material has conductive fillers.

13. The method of claim 8, wherein the conductive medium is any one of a polymer carrier having conductive particles, an inherently conductive thermoplastic material, a thermoplastic material having conductive particles, an inherently conductive thermosetting material, a thermosetting material having conductive particles, a conductive polymer, a carbon-based conductor, a carrier having conductive fibers, a carrier having conductive carbon nanotubes, a pressure sensitive adhesive having conductive fillers, and a solder.

14. The method of claim 8, wherein the integrated circuit is a circuit suitable for use with radio frequency, display, sensor, or phase array antenna applications.

15. The method of claim 8, wherein the large-scale component includes an antenna, an electronic display, a display electrode, a sensor, a power source, a memory device, and a logic device formed on that second substrate.

16. The method of claim 15, wherein the antenna is part of the second conductor.

17. The method of claim 8 further comprises dispensing a plurality of small and sharp particles in one of the first conductor or the second conductor, the particles to create a mechanical interlock between the first conductor and the second conductor when the first conductor and the second conductor are placed in immediate contact with one another.

18. The method of claim 17, wherein at least one of the first conductor and the second conductor is made of a thermosetting or a thermoplastic material.

19. The method of claim 17, forming an edge-seal around the edges of the first conductor and the second conductor.

20. The method of claim 8, wherein the particles are coated with a conductive material.

21. The method of claim 8 further comprises dispensing a plurality of small and sharp particles in one of the first conductor and the second conductor to enhance contact to the first conductor or the second conductor.

22. The method of claim 8 further comprises forming a conductive medium on the first conductor to interconnect the first conductor to the second conductor and dispensing a plurality of small and sharp particles in the conductive medium.

23. The method of claim 8 further comprises disposing a plurality of small and sharp particles into the material used to make one of the first conductor and the second conductor to attach the first conductor to the second conductor.