MEMS DEVICE PACKAGING METHODS
First Claim
1. A method of packaging a MEMS device, comprising the steps of:
- providing a MEMS die having a MEMS device and bond pads disposed thereon;
providing a MEMS package having a recess and bond pads disposed adjacent to the recess;
positioning the MEMS die over the MEMS package aligning the MEMS device of the MEMS die with the recess of the MEMS package, and aligning at least some of the bond pads of the MEMS die with at least some of the bond pads of the MEMS package;
inserting the MEMS die and MEMS package into a chamber and producing a controlled environment therein; and
sealing the MEMS die and MEMS package together along a ring to form a package having a hermitically sealed interior chamber that includes the MEMS device, as well as forming electrical connections between selected bond pads of the MEMS die with selected bond pads of the MEMS package.
1 Assignment
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Accused Products
Abstract
A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that has a recess, a seal ring and bond pads disposed thereon, positioning the MEMS die over the MEMS package to align the seal rings and bond pads, inserting the MEMS die and MEMS package into a vacuum chamber and evacuating gasses therefrom to form a controlled vacuum pressure therein, sealing the MEMS package and the MEMS die together at the seal rings to form a package having a hermitically sealed interior chamber and simultaneously forming electrical connections between the corresponding bond pads.
116 Citations
38 Claims
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1. A method of packaging a MEMS device, comprising the steps of:
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providing a MEMS die having a MEMS device and bond pads disposed thereon;
providing a MEMS package having a recess and bond pads disposed adjacent to the recess;
positioning the MEMS die over the MEMS package aligning the MEMS device of the MEMS die with the recess of the MEMS package, and aligning at least some of the bond pads of the MEMS die with at least some of the bond pads of the MEMS package;
inserting the MEMS die and MEMS package into a chamber and producing a controlled environment therein; and
sealing the MEMS die and MEMS package together along a ring to form a package having a hermitically sealed interior chamber that includes the MEMS device, as well as forming electrical connections between selected bond pads of the MEMS die with selected bond pads of the MEMS package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of packaging a MEMS device, comprising the steps of:
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providing a MEMS die having a MEMS device, a seal ring, and bond pads;
providing a MEMS package having a seal ring and bond pads;
providing a solder pre-form between the MEMS die and the MEMS package; and
positioning the MEMS die over the MEMS package so that the seal ring and bond pads of the MEMS die are aligned with the seal ring and bond pads of the MEMS package;
inserting the MEMS die and the MEMS package into a chamber and forming a controlled environment therein;
sealing the MEMS die and the MEMS package together using the solder pre-form to form a package having a hermitically sealed interior chamber with the MEMS device therein and simultaneously forming electrical connections between the bond pads of the MEMS die and MEMS package. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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36. A method of packaging a MEMS device, comprising:
flip-chip bonding a MEMS die having a MEMS device and a plurality of bond pads thereon to a MEMS package having a recess for receiving at least part of the MEMS device and a plurality of bond pads, to create a hermetically sealed interior chamber having the MEMS device therein, wherein the flip-chip bonding step simultaneously creates a seal between the MEMS die and the MEMS package and electrical connections between the pluralities of bond pads. - View Dependent Claims (37, 38)
Specification