Remote plasma pre-clean with low hydrogen pressure
First Claim
1. A method of plasma processing a substrate containing a dielectric layer, comprising the steps of:
- disposing the substrate in a vacuum chamber to which is attached a remote plasma source;
passing a reducing processing gas through the remote plasma source and thence into the chamber, the gas mixture comprising hydrogen and substantially no oxygen or water, and maintaining a pressure within the chamber such that a hydrogen partial pressure in the chamber is less than 150 milliTorr and greater than 10 milliTorr.
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Accused Products
Abstract
A plasma cleaning method particularly useful for removing photoresist and oxide residue from a porous low-k dielectric with a high carbon content prior to sputter deposition. A remote plasma source produces a plasma primarily of hydrogen radicals. The hydrogen pressure may be kept relatively low, for example, at 30 milliTorr. Optionally, helium may be added to the processing gas with the hydrogen partial pressure held below 150 milliTorr. Superior results are obtained with 70% helium in 400 milliTorr of hydrogen and helium. Preferably, an ion filter, such as a magnetic filter, removes hydrogen and other ions from the output of the remote plasma source and a supply tube from the remote plasma source includes a removable dielectric liner in combination with dielectric showerhead and manifold liner.
70 Citations
20 Claims
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1. A method of plasma processing a substrate containing a dielectric layer, comprising the steps of:
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disposing the substrate in a vacuum chamber to which is attached a remote plasma source;
passing a reducing processing gas through the remote plasma source and thence into the chamber, the gas mixture comprising hydrogen and substantially no oxygen or water, and maintaining a pressure within the chamber such that a hydrogen partial pressure in the chamber is less than 150 milliTorr and greater than 10 milliTorr. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of plasma processing a substrate, comprising the steps of:
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disposing the substrate in a vacuum chamber to which is attached a remote plasma source; and
passing a reducing processing gas through the remote plasma source and thence into the vacuum chamber, the processing gas comprising hydrogen and a noble gas and substantially no oxygen or water. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A plasma cleaning chamber, comprising:
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a vacuum chamber including a pedestal for support a substrate to be cleaned;
a dielectric showerhead opposed to the pedestal;
a remote plasma source;
a delivery tube connecting an output of the remote plasma source to the showerhead and including a removable dielectric liner;
an ion filter disposed on the delivery tube; and
a source of hydrogen gas for the remote plasma source. - View Dependent Claims (17, 18, 19, 20)
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Specification