MATERIALS FOR CHEMICAL MECHANICAL POLISHING

• US 20070117500A1
• Filed: 01/23/2007
• Published: 05/24/2007
• Est. Priority Date: 05/02/2005
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Prabhu, Gopalakrishna, Iyer, Anand, Leung, Garlen, Jackson, Robert, Rondum, Erik, Mcreynolds, Peter, Menk, Gregory, BONNER, BENJAMIN
• Granted Patent: US 7,429,210 B2
• Time in Patent Office: Days
• US Class Current: 451/527
• CPC Class Codes: B24B 7/228 for grinding thin, brittle parts, e.g. semiconductors, wafers grinding edges of thin, brittle parts B24B9/065
• CPC Class Codes: B24D 11/00 Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
• CPC Class Codes: B24D 2203/00 Tool surfaces formed with a pattern

Abstract

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Claims

1. A processing article for removing material from a substrate, comprising:

a linear base film; and

a plurality of polygonal polishing tiles made from a polishing material, the plurality of polishing tiles bound on the linear base film by an adhesive to form a plurality of grooves between the polishing tiles to enable fluid flow therein and facilitate delivery and take up in a roll format.

2. The processing article of claim 1, further comprising:

an upper film bound on the plurality of polishing tiles, the upper film adapted to enable adhesion of the plurality of tiles to the base film.

3. The processing article of claim 1, wherein a portion of the plurality of polishing tiles are of a length to span approximately one-half of the width of the base film.

4. The processing article of claim 1, wherein the plurality of polishing tiles define a polishing surface with a lateral portion in the polishing surface that is transparent to light or electromagnetic radiation.

5. The processing article of claim 1, wherein the plurality of polishing tiles are substantial parallelograms and are positioned diagonally on the base film.

6. The processing article of claim 1, wherein the plurality of polishing tiles are shaped as a parallelogram.

7. The processing article of claim 1, wherein the polishing tiles have an average surface roughness of about 0.5 micrometers to about 12 micrometers.

8. The processing article of claim 1, wherein the polishing tiles have a hardness of about 20 to about 80 on the Shore D hardness scale.

9. The processing article of claim 1, wherein at least a portion of the plurality of grooves are formed through the polishing material.

10. A replacement supply roll for a chemical mechanical polishing process, comprising:

a dowel having a polishing article wound thereon, the polishing article comprising;

a linear base film; and

a plurality of polygonal polishing tiles made from a polishing material, the plurality of polishing tiles bound on the linear base film by an adhesive to form a plurality of grooves between the polishing tiles to enable fluid flow therein and facilitate delivery and take up in a roll format.

11. The processing article of claim 10, further comprising an upper film bound on the plurality of polishing tiles to enhance adhesion of the plurality of polishing tiles to the base film.

12. The processing article of claim 10, wherein a portion of the plurality of polishing tiles are of a length to span approximately one-half of the width of the base film.

13. The processing article of claim 10, wherein the plurality of polishing tiles substantially covers a width of the base film.

14. The processing article of claim 10, wherein the plurality of polishing tiles define a polishing surface with a lateral portion that is transparent to light or electromagnetic radiation.

15. The processing article of claim 10, wherein the plurality of polishing tiles are substantial parallelograms and are positioned diagonally on the base film.

16. The processing article of claim 10, wherein the plurality of polishing tiles are shaped as parallelograms.

17. The processing article of claim 10, wherein the polishing tiles have an average surface roughness of about 0.5 micrometers to about 12 micrometers.

18. The processing article of claim 10, wherein the polishing tiles have a hardness of about 20 to about 80 on the Shore D hardness scale.

19. The processing article of claim 10, wherein each of the plurality of grooves are formed through the polishing material.

20. The processing article of claim 10, wherein a portion of the plurality of grooves are formed through the polishing material.