Method of assembling an in-vivo imaging device

• US 20070118012A1
• Filed: 11/22/2006
• Published: 05/24/2007
• Est. Priority Date: 11/23/2005
• Status: Abandoned Application

• Current Assignee: Given Imaging Limited (Medtronic Plc)
• Original Assignee: Given Imaging Limited (Medtronic Plc)
• Inventors: Gilad, Zvika
• Application Number:
  US11/603,123
• Publication Number:
  US 20070118012A1
• Time in Patent Office: Days
• US Class Current: 600/109
• CPC Class Codes: A61B 1/00016 using wireless means
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/00163 Optical arrangements A61B1/002, A61B1/06 take precedence
• CPC Class Codes: A61B 1/00181 for multiple fixed viewing angles A61B1/00193 takes precedence
• CPC Class Codes: A61B 1/041 Capsule endoscopes for imaging
• CPC Class Codes: A61B 1/042 characterised by a proximal camera, e.g. a CCD camera
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61B 1/0607 for annular illumination
• CPC Class Codes: A61B 1/0676 at distal tip of an endoscope
• CPC Class Codes: A61B 1/0684 using light emitting diodes [LED]
• CPC Class Codes: A61B 1/273 for the upper alimentary canal, e.g. oesophagoscopes, gastroscopes
• CPC Class Codes: A61B 5/073 Intestinal transmitters
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

An in-vivo imaging device having a closed housing containing internal components including two optical heads located on rigid portions of a circuit board connected by a flexible portion. The housing consists of a connecting sleeve located between two domes. The in-vivo imaging device is assembled by positioning at least part of the circuit board inside the connecting sleeve and folding the circuit board so that the optical heads cover ends of the connecting sleeve. The domes are placed over the optical heads and joined to the connecting sleeve.

Claims

1. A method for assembling an in-vivo imaging device comprising the steps of:

(i) providing two optical heads and a circuit board having two rigid portions connected by a flexible portion;

(ii) attaching the optical heads to the rigid portions;

(iii) providing a first sleeve having two opposing open ends;

(iv) folding the circuit board so that the optical heads are positioned over the open ends;

(v) placing domes over the optical heads; and

(vi) bringing the domes into abutment with the first sleeve so that the first sleeve and the domes form a closed housing enclosing the circuit board and the optical heads.

2. The method according to claim 1, comprising the further steps of:

(a) placing at least one battery in a second sleeve having two opposing open ends; and

(b) placing the second sleeve in the first sleeve.

3. The method according to claim 2, wherein step (a) is performed prior to step (iv).

4. The method according to claim 1, comprising the further step of placing at least one battery in the first sleeve.

5. The method according to claim 1, wherein the first sleeve is placed between the two optical heads with the flexible portion passing between the two opposing open ends prior to step (iv);

and at least one battery is placed in the first sleeve after positioning one of the optical heads over one of the open ends.

6. The method according to claim 1, comprising the further step of joining the domes to the first sleeve.

7. The method according to claim 6, wherein the domes are joined to the first sleeve by a process chosen from the following group:

gluing, fraction fitting, press fitting, snap fitting, laser welding, laser melting, spin welding, and ultra sonic welding.

8. A method for assembling an in-vivo imaging device comprising:

(i) attaching optical heads to a circuit board;

(ii) folding the circuit board so that the optical heads are positioned over the open ends of a connecting sleeve;

(iii) placing domes over the optical heads; and

(vi) bringing the domes into abutment with the first sleeve so that the connecting sleeve and the domes form a closed housing enclosing the circuit board and the optical heads.