Built-in capacitor type wiring board and method for manufacturing the same
First Claim
1. A built-in capacitor type wiring board, comprising:
- a core board;
a multilayer portion formed on at least one side of said core board and comprising a plurality of interlayer insulating layers and a plurality of conductor layers alternately laminated on said core board; and
a capacitor of a chip-like shape having a first main surface and a second main surface, said capacitor comprising;
a dielectric layer;
an electrode layer laminated on said dielectric layer; and
a hole portion opening at least at said second main surface, wherein said capacitor is embedded in said interlayer insulating layers so that said second main surface faces said core board.
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Accused Products
Abstract
In order to provide a built-in capacitor type wiring board capable of preventing misalignment of the capacitor, a capacitor built-in type wiring board is provided which includes a core board; a multilayer portion disposed on at least one side of the core board and formed by a plurality of interlayer insulating layers; and a plurality of conductor layers alternately laminated on the core board. The capacitor is of a chip-like shape with first and second main surfaces and includes a dielectric layer; electrode layers laminated on the dielectric layer; and a hole portion opening at least at the second main surface. The capacitor is embedded in the interlayer insulating layers so that the second main surface faces the core board.
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Citations
8 Claims
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1. A built-in capacitor type wiring board, comprising:
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a core board;
a multilayer portion formed on at least one side of said core board and comprising a plurality of interlayer insulating layers and a plurality of conductor layers alternately laminated on said core board; and
a capacitor of a chip-like shape having a first main surface and a second main surface, said capacitor comprising;
a dielectric layer;
an electrode layer laminated on said dielectric layer; and
a hole portion opening at least at said second main surface, wherein said capacitor is embedded in said interlayer insulating layers so that said second main surface faces said core board. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a built-in capacitor type wiring board, said method comprising:
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a preparation step comprising preparing a built-in capacitor of a chip-like shape having a first main surface and a second main surface, and comprising a dielectric layer, an electrode layer laminated on said dielectric layer and a hole portion opening at least at said second main surface;
a mounting step in which said capacitor is mounted on a first interlayer insulating layer which constitutes part of a multilayer portion comprising a plurality of interlayer insulating layers and a plurality of conductor layers alternately laminated on a core board, so that a part of said first interlayer insulating layer flows into said hole portion as a result of mounting said capacitor so as to face said second main surface; and
an enclosure step wherein a further interlayer insulating layer is laminated on said capacitor after said mounting step so as to enclose said capacitor in said multilayer portion.
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Specification