Built-in capacitor type wiring board and method for manufacturing the same

• US 20070121273A1
• Filed: 11/20/2006
• Published: 05/31/2007
• Est. Priority Date: 11/30/2005
• Status: Active Grant

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Sato, Manabu, Otsuka, Jun, Yamamoto, Hiroshi, Seki, Toshitake, Inui, Yasuhiko
• Granted Patent: US 7,532,453 B2
• Time in Patent Office: Days
• US Class Current: 361/306.200
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10712 : Via grid array, e.g. via grid array capacitor
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

In order to provide a built-in capacitor type wiring board capable of preventing misalignment of the capacitor, a capacitor built-in type wiring board is provided which includes a core board; a multilayer portion disposed on at least one side of the core board and formed by a plurality of interlayer insulating layers; and a plurality of conductor layers alternately laminated on the core board. The capacitor is of a chip-like shape with first and second main surfaces and includes a dielectric layer; electrode layers laminated on the dielectric layer; and a hole portion opening at least at the second main surface. The capacitor is embedded in the interlayer insulating layers so that the second main surface faces the core board.

Claims

1. A built-in capacitor type wiring board, comprising:

a core board;

a multilayer portion formed on at least one side of said core board and comprising a plurality of interlayer insulating layers and a plurality of conductor layers alternately laminated on said core board; and

a capacitor of a chip-like shape having a first main surface and a second main surface, said capacitor comprising;

a dielectric layer;

an electrode layer laminated on said dielectric layer; and

a hole portion opening at least at said second main surface,

wherein said capacitor is embedded in said interlayer insulating layers so that said second main surface faces said core board.

2. A built-in capacitor wiring board according to claim 1,

wherein said dielectric layer comprises a plurality of dielectric layers and said electrode layer comprises a plurality of inner electrode layers, and said capacitor comprises a capacitor main body having a structure wherein said dielectric layers and inner electrode layers are alternately laminated;

and

wherein said capacitor comprises a via array capacitor including a plurality of via holes disposed in an array and each via hole includes a via conductor therein providing an electrical connection to said inner electrode layers.

3. A built-in capacitor wiring board according to claim 1,

wherein said capacitor includes a metal reinforcement layer supporting said dielectric layer and of a thickness greater than that of said dielectric layer.

4. A built-in capacitor wiring board according to claim 1,

wherein said hole portion comprises a through-hole that opens at both said first main surface and said second main surface.

5. A built-in capacitor wiring board according to claim 1,

wherein said hole portion comprises a plurality of holes disposed in plural locations along an outer circumference of said capacitor.

6. A built-in capacitor wiring board according to claim 2,

wherein said hole portion has a diameter no greater than that of said via holes.

7. A built-in capacitor wiring board according to claim 1, wherein said capacitor has an overall thickness between about 10 μ

m and 200 μ

m.

8. A method for manufacturing a built-in capacitor type wiring board, said method comprising:

a preparation step comprising preparing a built-in capacitor of a chip-like shape having a first main surface and a second main surface, and comprising a dielectric layer, an electrode layer laminated on said dielectric layer and a hole portion opening at least at said second main surface;

a mounting step in which said capacitor is mounted on a first interlayer insulating layer which constitutes part of a multilayer portion comprising a plurality of interlayer insulating layers and a plurality of conductor layers alternately laminated on a core board, so that a part of said first interlayer insulating layer flows into said hole portion as a result of mounting said capacitor so as to face said second main surface; and

an enclosure step wherein a further interlayer insulating layer is laminated on said capacitor after said mounting step so as to enclose said capacitor in said multilayer portion.