COMPUTER SYSTEM WITH COOLING DEVICE FOR CPU

• US 20070121296A1
• Filed: 11/29/2005
• Published: 05/31/2007
• Est. Priority Date: 11/29/2005
• Status: Active Grant

• Current Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Original Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Inventors: Chen, Bao-Chun, Chen, Chun-Chi, Wung, Shih-Hsun
• Granted Patent: US 7,286,357 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

Claims

1. A computer system, comprising:

a casing comprising a pair of parallel panels, air inlets and air outlets respectively being defined in the parallel panels, the air inlets oriented toward the air outlets;

a motherboard parallelly positioned between the parallel panels;

a CPU mounted on the motherboard; and

a cooling device having a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

2. The computer system as claimed in claim 1, wherein the casing further comprises an additional panel perpendicular to and between the parallel panels.

3. The computer system as claimed in claim 2, wherein the heat dissipation portion is disposed between the motherboard and the additional panel.

4. The computer system as claimed in claim 1, wherein the heat dissipation portion extends in a direction across the motherboard.

5. The computer system as claimed in claim 1, wherein the cooling device further comprises an additional heat dissipation portion attached to the base portion.

6. The computer system as claimed in claim 5, wherein the cooling device further comprises an additional heat pipe thermally connecting a top section of the additional heat dissipation portion to the base portion.

7. The computer system as claimed in claim 6, wherein the additional heat pipe is inserted through the top section of the additional heat dissipation portion.

8. The computer system as claimed in claim 5, wherein the additional heat dissipation portion and the fan adjoin to one of the parallel panels.

9. A computer system, comprising:

a casing defining aligned air inlets and air outlets at opposite sides thereof, an airflow path extending through the air inlets and the air outlets;

a motherboard positioned within the casing;

a CPU mounted on the motherboard; and

a cooling device comprising a base portion contacting the CPU, a heat dissipation portion, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan;

wherein the airflow path is perpendicular to the motherboard, the heat dissipation portion and the fan are disposed in the airflow path from the air inlets to the air outlets.

10. The computer system as claimed in claim 9, wherein the cooling device further comprises an additional heat dissipation portion attached on the base portion.

11. The computer system as claimed in claim 10, wherein the cooling device comprises an additional heat pipe thermally connecting the additional heat dissipation portion to the base portion.

12. The computer system as claimed in claim 9, wherein the at least one heat pipe is U-shaped.

13. A computer system comprising:

a casing having two opposite first wall and second wall, the first wall defining an air inlet and the second wall defining an air outlet, an airflow path being defined between the air inlet and the air outlet;

a circuit board located in the casing at a position spaced from the airflow path;

a heat-generating electronic component mounted on the circuit board;

a heat dissipation device having a first portion in thermal contacting with the heat-generating electronic component and a second portion extending through an edge of the circuit board into the airflow path.

14. The computer system of claim 13, wherein the airflow path has a length which is substantially the same as one of dimensions of the casing wherein the one of the dimensions is the shortest than the other dimensions.

15. The computer system of claim 13 further comprising a heat pipe thermally connecting the first portion and the second portion.

16. The computer system of claim 13 further comprising a fan mounted on the second portion of the heat dissipation device and located between the second portion and the air inlet.

17. The computer system of claim 16, wherein the first portion of the heat dissipation device comprises a base, a first heat dissipation portion and a heat pipe thermally connecting the base and the first heat dissipation portion, the base thermally contacting with the heat-generating electronic component.

18. The computer system of claim 13, wherein the second portion defines a recess, a fan being received in the recess and located between the second portion and the air inlet, and the first portion defining a recess, a base being received in the recess of the first portion and thermally contacting with the heat-generating electronic component.

19. The computer system of claim 18, wherein the recess of the first portion is defined in a bottom surface thereof, and the recess of the second portion is defined in a top surface thereof.

20. The computer system of claim 14 further comprising a fan mounted on the second portion, and wherein the circuit board is oriented parallel to the first and second walls.