Method for producing flexible, stretchable, and implantable high-density microelectrode arrays

• US 20070123963A1
• Filed: 11/29/2005
• Published: 05/31/2007
• Est. Priority Date: 11/29/2005
• Status: Abandoned Application

• Current Assignee: Cordis Corporation (Cardinal Health, Inc.)
• Original Assignee: Cordis Corporation (Cardinal Health, Inc.)
• Inventors: Krulevitch, Peter
• Application Number:
  US11/288,759
• Publication Number:
  US 20070123963A1
• Time in Patent Office: Days
• US Class Current: 607/115
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula

Abstract

A high-density microelectrode array that is flexible and stretchable and can also be implanted within living tissue is provided. The microelectrode array includes at least first and second implantable and biocompatible polymeric layers in which a plurality of patterned conductive features, including metallic contact pads, metallic traces and metallic electrodes are sandwiched therebetween. Each metallic trace is located between a metallic contact pad and a metallic electrode and has substantially rounded corners and a zigzag pattern. The latter features are provided using stent technology. The present invention also provides a method of fabricating such a flexible, stretchable, and implantable microelectrode arrays which combined micromaching technology and stent technology as well as an implantable medical device that includes the inventive microelectrode array.

Claims

1. A method of forming a microelectrode array for use as an element in implantable medical device comprising:

providing a bonded structure including a first structure comprising at least a first implantable and biocompatible polymeric layer and a second structure comprising a plurality of conductive features including metallic contact pads, metallic traces, and metallic electrodes, wherein each metallic trace has a zigzag pattern and substantially rounded corners; and

forming a second implantable and biocompatible polymeric layer to said bonded structure, said second polymeric layer covering said plurality of conductive features and has vias therein that extend down to said metallic contact pads and said metallic electrodes.

2. The method of claim 1 wherein said first and second polymeric layers are comprised of a same or a different polymeric material, said polymeric material selected from the group consisting of a silicone polymer, a polyurethane, a polyamide, parylene, a fluoropolymer, a polyolefin, collagen, chitin, alginate, polyvinyl pyrrolidone, polyethylene glycol, polyethylene oxide, polyvinyl alcohol, polyglycol lactic acid, polylactic acid, polycaprolactone, polyamino acid, and a hydrogel.

3. The method of claim 2 wherein both said first and second polymeric layers are comprised of a silicone polymer.

4. The method of claim 3 wherein said silicone polymer is poly(dimethylsiloxane).

5. The method of claim 1 wherein said plurality of conductive features are comprised of a conductive metal or metal alloy selected from the group consisting of Pt, Ti and NiTi.

6. The method of claim 5 wherein said conductive metal or metal alloy is Pt or NiTi.

7. The method of claim 1 wherein said providing said bonded substrate comprises a nominal room temperature bonding process and contacting of said first structure to said second structure such that an exposed surface of said first polymeric layer is in contact with an exposed surface of said plurality of conductive features.

8. The method of claim 1 wherein said plurality of conductive features is formed by laser etching a metallic sheet or foil or photolithography and etching of a metallic sheet or foil.

9. The method of claim 1 wherein said steps of bonding and forming are repeated to form a multi-layered 3D microelectrode array.

10. The method of claim 1 further comprising forming a conductive material within said vias.

11. A microelectrode array for use as an element in an implantable medical device comprising at least first and second implantable and biocompatible polymeric layers in which a plurality of patterned conductive features including metallic contact pads, metallic traces and metallic electrodes is sandwiched therebetween, wherein each metallic trace has a zigzag pattern and substantially rounded corners.

12. The microelectrode array of claim 11 wherein said first and second polymeric layers are comprised of a same or a different polymeric material, said polymeric material selected from the group consisting of a silicone polymer, a polyurethane, a polyamide, parylene, a fluoropolymer, a polyolefin, collagen, chitin, alginate, polyvinyl pyrrolidone, polyethylene glycol, polyethylene oxide, polyvinyl alcohol, polyglycol lactic acid, polylactic acid, polycaprolactone, polyamino acid, and a hydrogel.

13. The microelectrode array of claim 12 wherein both said first and second polymeric layers are comprised of a silicone polymer, a polyurethane, a polyamide, parylene, a fluoropolymer, a polyolefin, collagen, chitin, alginate, polyvinyl pyrrolidone, polyethylene glycol, polyethylene oxide, polyvinyl alcohol, polyglycol lactic acid, polylactic acid, polycaprolactone, polyamino acid, and a hydrogel.

14. The microelectrode array of claim 13 wherein said silicone polymer is poly(dimethylsiloxane).

15. The microelectrode array of claim 11 wherein said plurality of conductive features are comprised of a conductive metal or metal alloy selected from the group consisting of Pt, Ti and NiTi.

16. The microelectrode array of claim 15 wherein said conductive metal or metal alloy is Pt or NiTi.

17. The microelectrode array of claim 11 further comprising a plurality of conductively filled vias in said second polymeric layer that expose said metallic contact pads and said metallic electrodes.

18. The microelectrode array of claim 11 wherein said zigzag pattern contains from about 2 to about 200 turns and angles therein.

19. The microelectrode array of claim 11 further comprising additional implantable and biocompatible polymeric layers atop the second polymeric layer, wherein said plurality of conductive features is also present between each of said polymeric layers.

20. An implantable medical device comprising at least first and second implantable and biocompatible polymeric layers in which a plurality of patterned conductive features including metallic contact pads, metallic traces and metallic electrodes is sandwiched therebetween, wherein each said metallic trace has substantially rounded corners and a zigzag pattern and said second polymeric layer has conductively filled vias that extend down to said metallic contact pad and said metallic electrode.