Integrated tire pressure sensor system

• US 20070125161A1
• Filed: 12/01/2005
• Published: 06/07/2007
• Est. Priority Date: 12/01/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Sensors Licensing LLC
• Inventors: Bryzek, Janusz, Ray, Curtis, Logan, Elizabeth, Bircumshaw, Brian
• Granted Patent: US 7,518,493 B2
• Time in Patent Office: Days
• US Class Current: 73/146.400
• CPC Class Codes: B60C 23/0408 transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/015 the micromechanical device and the control or processing electronics being integrated on the same substrate
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer

Abstract

The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.

Claims

1. An integrated tire pressure sensor system, comprising:

(a) one or more MEMS-based sensors, including a MEMS-based pressure sensor for sensing a pressure of a tire;

(b) a MEMS-oscillator-based wireless signal transmitter for transmitting data generated by said MEMS-based pressure sensor, wherein said MEMS-oscillator-based wireless signal transmitter comprises;

(i) a MEMS-oscillator-based resonator for generating a desired output frequency;

(ii) a fractional-N synthesizer to modify said desired output frequency of said MEMS-oscillator-based resonator; and

(iii) a power amplifier for amplifying said signal; and

(c) a microcontroller for;

(i) processing the data generated by at least one of said one or more MEMS-based sensors;

(ii) controlling at least one of said one or more MEMS-based sensors; and

(iii) controlling the encoding and timing of said transmitting of said data;

wherein said one or more MEMS-based sensors, said MEMS-oscillator-based wireless signal transmitter and said microcontroller are integrated onto one or more chips in one or more packages.

2. The integrated tire pressure sensor system as set forth in claim 1, wherein said one or more MEMS-based sensors, said MEMS-oscillator-based wireless signal transmitter and said microcontroller are integrated onto one chip.

3. The integrated tire pressure sensor system as set forth in claim 1, wherein said one or more MEMS-based sensors, said MEMS-oscillator-based wireless signal transmitter and said microcontroller are integrated onto two chips.

4. The integrated tire pressure sensor system as set forth in claim 1, further comprising a MEMS-based reference capacitor for compensating said one or more MEMS-based sensors.

5. The integrated tire pressure sensor system as set forth in claim 1, further comprising one or more IC-based sensors.

6. The integrated tire pressure sensor system as set forth in claim 5, wherein said one or more IC-based sensors is selected from the group consisting of a voltage sensor and a temperature sensor.

7. The integrated tire pressure system as set forth in claim 1, wherein said one or more MEMS-based sensors are capacitive sensors.

8. The integrated tire pressure sensor system as set forth in claim 1, wherein said one or more MEMS-based sensors is selected from the group consisting of a tri-axial motion sensor, a dual-axis motion sensor, a gyroscope, a velocity sensor, a vacuum sensor, a force sensor, a light sensor and a temperature sensor.

9. The integrated tire pressure sensor system as set forth in claim 1, wherein said fractional-N synthesizer is operably connected to a temperature sensor for said modifying of said desired output frequency.

10. The integrated tire pressure sensor system as set forth in claim 1, wherein said fractional-N synthesizer is operably connected to a voltage sensor for said modifying of said desired output frequency.

11. The integrated tire pressure sensor system as set forth in claim 1, further comprising a signal processor operably connected to at least one of said one or more MEMS-based sensors for processing said data generated by at least one of said one or more MEMS-based sensors.

12. The integrated tire pressure sensor system as set forth in claim 1, wherein said MEMS-oscillator-based resonator comprises a disc, a beam, a diaphragm, an annulus or a polyhedron.

13. The integrated tire pressure sensor system as set forth in claim 1, wherein said fractional-N synthesizer decreases variation of said output frequency of said MEMS-oscillator-based resonator to about ±

100 ppm over a temperature range of about −

40°

C. to about 125°

C. and a polarization voltage range of about 12 V to about 15 V.

14. The integrated tire pressure sensor system as set forth in claim 1, wherein said MEMS-oscillator-based resonator is operably connected to a programming interface for modifying one or more parameters of said output frequency generated by said MEMS-based resonator.

15. The integrated tire pressure sensor system as set forth in claim 1, further comprising an ultra-compact battery, a MEMS-based energy scavenging system, or said ultra-compact battery and said MEMS-based energy scavenging system.

16. The integrated tire pressure sensor system as set forth in claim 1, further comprising a voltage regulator operably connected to a voltage sensor for regulating the amount of voltage supplied to said one or more chips.

17. The integrated tire pressure sensor system as set forth in claim 1, wherein said one or more packages is one package.

18. The integrated tire pressure sensor system as set forth in claim 17, wherein said package has a body width of between about 5.0 mm and about 5.6 mm.

19. The integrated tire pressure sensor system as set forth in claim 17, wherein said package has a length of between about 7.9 mm to about 8.5 mm.

20. The integrated tire pressure sensor system as set forth in claim 17, wherein said package has connections to a circuit board.

21. The integrated tire pressure sensor system as set forth in claim 20, wherein said connections are leads.

22. The integrated tire pressure sensor system as set forth in claim 20, wherein the number of said connections is between 16 and 32.

23. The integrated tire pressure sensor system as set forth in claim 20, wherein the number of said connections is 24.

24. The integrated tire pressure sensor system as set forth in claim 17, wherein said package is a Small Outline Package, a Dual Flat No-lead package or a Quad Flat No-lead package.

25. The integrated tire pressure sensor system as set forth in claim 17, wherein said package has a footprint with a width of about 7.4 mm to 8.2 mm.

26. The integrated tire pressure sensor system as set forth in claim 1, wherein said microcontroller is an asynchronous microcontroller.

27. The integrated tire pressure sensor system as set forth in claim 1, further comprising a polarization voltage generator.

28. The integrated tire pressure sensor system as set forth in claim 1, further comprising a LF receiver.

29. A method of sensing a pressure of a tire with an integrated tire pressure system, comprising:

(a) integrating on one or more chips a plurality of components, including;

(i) one or more MEMS-based sensors, including a MEMS-based pressure sensor;

(ii) a MEMS-oscillator-based wireless signal transmitter, comprising;

(a) a MEMS-oscillator-based resonator for generating a desired output frequency;

(b) a fractional-N synthesizer to modify said desired output frequency of said MEMS-oscillator-based resonator; and

(c) a power amplifier for amplifying said signal; and

(iii) a microcontroller;

(b) sensing at least one parameter, including pressure of a tire, with at least one of said one or more MEMS-based sensors;

(c) processing data generated by at least one of said one or more MEMS-based sensors with said microcontroller;

(d) controlling at least one of said one or more MEMS-based sensors with said microcontroller;

(e) controlling the encoding and timing of transmission of pressure data generated by said MEMS-based pressure sensor with said microcontroller; and

(f) transmitting pressure data generated by said MEMS-based pressure sensor using said MEMS-oscillator-based wireless signal transmitter.

30. The method as set forth in claim 29, wherein said one or more MEMS-based sensors, said MEMS-oscillator-based wireless signal transmitter and said microcontroller are integrated onto one chip.

31. The method as set forth in claim 29, wherein said one or more MEMS-based sensors, said MEMS-oscillator-based wireless signal transmitter and said MEMS-based microcontroller are integrated onto two chips.

32. The method as set forth in claim 29, further comprising integrating a MEMS-based reference capacitor for compensating said one or more MEMS-based sensors.

33. The method as set forth in claim 29, further comprising integrating one or more IC-based sensors.

34. The method as set forth in claim 33, wherein said one or more IC-based sensors is selected from the group consisting of a voltage sensor and a temperature sensor.

35. The method as set forth in claim 29, wherein said one or more MEMS-based sensors are capacitive sensors.

36. The method as set forth in claim 29, wherein said one or more MEMS-based sensors is selected from the group consisting of a tri-axial motion sensor, a dual-axis motion sensor, a velocity sensor, a gyroscope, a vacuum sensor, a force sensor, a light sensor and a temperature sensor.

37. The method as set forth in claim 29, wherein said fractional-N synthesizer utilizes data generated by a temperature sensor for said modifying of said desired output frequency.

38. The method as set forth in claim 29, wherein said fractional-N synthesizer utilizes data generated by a voltage sensor for said modifying of said desired output frequency.

39. The method as set forth in claim 29, further comprising integrating a signal processor for processing said data generated by at least one of said one or more MEMS-based sensors.

40. The method as set forth in claim 29, wherein said MEMS-oscillator based resonator comprises a disc, a beam, a diaphragm, an annulus or a polyhedron.

41. The method as set forth in claim 29, wherein said fractional-N synthesizer decreases variation of said output frequency of said MEMS-oscillator-based resonator to about ±

100 ppm over a temperature range of about −

40°

C. to about 125°

C. and a polarization voltage range of about 12 V to about 15 V.

42. The method as set forth in claim 29, further comprising programming said MEMS-oscillator-based transmitter to modify one or more parameters of said output frequency generated by said MEMS-based resonator.

43. The method as set forth in claim 29, further comprising integrating an ultra-compact battery, a MEMS-based energy scavenging system, or an ultra-compact battery and a MEMS-based energy scavenging system into said integrated tire pressure sensor system.

44. The method as set forth in claim 29, further comprising integrating a voltage regulator into said integrated tire pressure sensor system for regulating the amount of voltage supplied to said one or more chips.

45. The method as set forth in claim 29, further comprising packaging said one or more chips into one or more packages.

46. The method as set forth in claim 29, wherein said microcontroller is an asynchronous microcontroller.

47. The method as set forth in claim 29, further comprising integrating a polarization voltage generator into said integrated tire pressure sensor system.

48. The method as set forth in claim 29, further comprising integrating a LF receiver into said integrated tire pressure sensor system.

49. An integrated tire pressure sensor system, comprising:

(a) one or more MEMS-based sensors, including a MEMS-based pressure sensor for sensing a pressure of a tire;

(b) a wireless signal transmitter for transmitting data generated by said MEMS-based pressure sensor, wherein said wireless signal transmitter comprises a power amplifier; and

(c) a microcontroller for;

(i) processing the data generated by at least one of said one or more MEMS-based sensors;

(ii) controlling at least one of said one or more MEMS-based sensors; and

(iii) controlling the encoding and timing of transmitting of said data;

wherein said one or more MEMS-based sensors, said power amplifier and said microcontroller are integrated onto one or more chips in one package.

50. The integrated tire pressure sensor system as set forth in claim 49, wherein said package further includes a MEMS-based reference capacitor for compensating said one or more MEMS-based sensors.

51. The integrated tire pressure sensor system as set forth in claim 49, wherein said package further includes one or more IC-based sensors.

52. The integrated tire pressure sensor system as set forth in claim 51, wherein said one or more IC-based sensors is selected from the group consisting of a voltage sensor and a temperature sensor.

53. The integrated tire pressure sensor system as set forth in claim 49, wherein said one or more MEMS-based sensors is selected from the group consisting of a tri-axial motion sensor, a dual-axis motion sensor, a gyroscope, a velocity sensor, a vacuum sensor, a force sensor, a light sensor and a temperature sensor.

54. The integrated tire pressure sensor system as set forth in claim 49, wherein said integrated tire pressure sensor system further comprises a resonator operably connected to said package.

55. The integrated tire pressure sensor system as set forth in claim 49, wherein said package further includes a fractional-N synthesizer.

56. The integrated tire pressure sensor system as set forth in claim 49, wherein said package further includes a signal processor for processing said data generated by at least one of said one or more MEMS-based sensors.

57. The integrated tire pressure sensor system as set forth in claim 49, wherein said package has a body width of between about 5.0 mm and about 5.6 mm.

58. The integrated tire pressure sensor system as set forth in claim 49, wherein said package has a length of between about 7.9 mm to about 8.5 mm.

59. The integrated tire pressure sensor system as set forth in claim 49, wherein said package has a footprint with a width of about 7.4 mm to 8.2 mm.

60. The integrated tire pressure sensor system as set forth in claim 49, wherein said package has connections to a circuit board.

61. The integrated tire pressure sensor system as set forth in claim 60, wherein said connections are leads.

62. The integrated tire pressure sensor system as set forth in claim 60, wherein the number of said connections is between 16 and 32.

63. The integrated tire pressure sensor system as set forth in claim 60, wherein the number of said connections is 24.

64. The integrated tire pressure sensor system as set forth in claim 49, wherein said package is a Small Outline Package, a Dual Flat No-lead package or a Quad Flat No-lead package.

65. The integrated tire pressure sensor system as set forth in claim 49, wherein said microcontroller is an asynchronous microcontroller.

66. The integrated tire pressure sensor system as set forth in claim 49, wherein said package further includes a LF receiver.