White light emitting diode

• US 20070126011A1
• Filed: 05/15/2006
• Published: 06/07/2007
• Est. Priority Date: 12/01/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Ik
• Granted Patent: US 7,759,683 B2
• Time in Patent Office: Days
• US Class Current: 257/89
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

The present invention relates to a white light emitting diode comprising a blue light emitting diode chip; a green light emitting diode chip; and a molding member that encapsulates the blue light emitting diode chip and a green light emitting diode chip, the molding member containing a red fluorescent substance.

Claims

1. A white light emitting diode, comprising:

a blue light emitting diode chip;

a green light emitting diode chip; and

a molding member for encapsulating the blue light emitting diode chip and the green light emitting diode chip, the molding member containing a red fluorescent substance.

2. The white light emitting diode as claimed in claim 1, wherein the red fluorescent substance comprises (Sr_1-xEu_x)S or (Ca_1-xEu_x)S where x is 0.001 to 0.02.

3. The white light emitting diode as claimed in claim 2, wherein the molding member comprises a resin.

4. The white light emitting diode as claimed in claim 2, further comprising lead terminals for use in applying a voltage to the light emitting diode chips;

and a substrate having the lead terminals arranged thereon.

5. The white light emitting diode as claimed in claim 4, further comprising:

a reflection portion arranged on the substrate to reflect light emitted from the light emitting diode chips in a predetermined direction.