Method for packaging semiconductor device and package structure thereof
First Claim
1. A method for packaging an semiconductor device, the method comprising:
- providing a first substrate, at least one semiconductor device disposed on a surface of the first substrate, the first substrate comprising at least one first pattern;
providing a spacer with at least one aperture and at least one through hole;
connecting the first substrate and the spacer by aiming the first pattern at the through hole, so that the semiconductor device is positioned correspondingly to the aperture;
providing a second substrate comprising at least one second pattern; and
connecting the spacer and the second substrate by aiming the second pattern at the through hole.
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Abstract
A method for packaging an semiconductor device includes following steps. First, a first substrate including at least one first pattern is provided. At least one semiconductor device is disposed on the surface of the first substrate. Next, a spacer with at least one aperture and at least one through hole is provided. Then, the first pattern is aimed at the through hole to connect the first substrate and the spacer, so that the semiconductor device is positioned correspondingly to the aperture. Afterwards, a second substrate including at least one second pattern is provided. Thereon, the second pattern is aimed at the through hole, so that the second substrate is connected to the spacer correspondingly.
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Citations
12 Claims
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1. A method for packaging an semiconductor device, the method comprising:
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providing a first substrate, at least one semiconductor device disposed on a surface of the first substrate, the first substrate comprising at least one first pattern;
providing a spacer with at least one aperture and at least one through hole;
connecting the first substrate and the spacer by aiming the first pattern at the through hole, so that the semiconductor device is positioned correspondingly to the aperture;
providing a second substrate comprising at least one second pattern; and
connecting the spacer and the second substrate by aiming the second pattern at the through hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An semiconductor package comprising:
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a first substrate comprising a first pattern;
an semiconductor device disposed on the first substrate;
a spacer with an aperture and a through hole, the spacer connected to the first substrate, the aperture aimed to the optical device, the first pattern aimed at the through hole; and
a second substrate disposed on the spacer, the second substrate comprising a second pattern corresponding to the through hole. - View Dependent Claims (10, 11, 12)
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Specification