PROBING APPARATUS, PROBING CIRCUIT BOARD AND PROBING SYSTEM FOR HIGH-VOLTAGE MATRIX PROBING

• US 20070126438A1
• Filed: 09/27/2006
• Published: 06/07/2007
• Est. Priority Date: 11/30/2005
• Status: Active Grant

• Current Assignee: Chun Hung Tang
• Original Assignee: Ip Leader Technology Corporation
• Inventors: Tang, Li-Jen
• Granted Patent: US 7,358,753 B2
• Time in Patent Office: Days
• US Class Current: 324/750.90
• CPC Class Codes: G01R 31/2808 Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards probe, multiprobe, probe manipulator or probe fixture G01R1/067

Abstract

A probing apparatus, probing circuit board and probing system for high-voltage matrix probing are provided. Switching circuits of the probing apparatus capable of probing a plurality of probing points for high-voltage matrix probing are manufactured with using a mixed high-voltage IC process. The probing circuit board comprises a plurality of probing apparatuses integrated on a bare circuit board. The probing system comprises a plurality of probing circuit boards integrated in a machine.

Claims

1. A probing apparatus for high-voltage matrix probing, the probing apparatus, electrically connected with a plurality of probe points and a plurality of interface signals, receiving a test signal and generating a probing result, the probing apparatus comprising:

a plurality of probing pins;

a command decoding unit manufactured with a mixed high-voltage IC process;

a plurality of transmission switch elements manufactured with the mixed high-voltage IC process; and

a plurality of receiving switch elements manufactured with the mixed high-voltage IC process;

wherein the plurality of probing pins are electrically connected with the plurality of probe points, the command decoding unit is electrically connected with the plurality of interface ports and controls on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements transmit the test signal to the corresponding probing pins in response to the command decoding unit, and the plurality of receiving switch elements generate the probing result corresponding to the corresponding probing pins in response to the command decoding unit.

2. The probing apparatus as claimed in claim 1, wherein the command decoding unit is manufactured with a low-voltage IC process of the mixed high-voltage IC process.

3. The probing apparatus as claimed in claim 2, wherein the low-voltage IC process is a CMOS process.

4. The probing apparatus as claimed in claim 1, wherein the plurality of transmission switch elements and the plurality of receiving switch elements are manufactured with a medium-high voltage IC process of the mixed high-voltage IC process.

5. The probing apparatus as claimed in claim 4, wherein the medium-high voltage IC process is a bipolar transistor process.

6. The probing apparatus as claimed in claim 4, wherein the medium-high voltage IC process is a DMOS process.

7. The probing apparatus as claimed in claim 1, wherein an acceptable voltage range of the plurality of transmission switch elements and the plurality of receiving switch elements is within ±

800 volts.

8. The probing apparatus as claimed in claim 1, further comprising a verification unit, manufactured with the mixed high-voltage IC process, for verifying the probing result and transmitting the probing result out.

9. A probing circuit board for high-voltage matrix probing, the probing circuit board, electrically connected with a plurality of probe points and a plurality of interface signals, receiving a test signal and generating a probing result, the probing circuit board comprising:

a bare printed circuit board;

a connection unit mounted on the bare printed circuit board; and

a plurality of probing apparatuses mounted on the bare printed circuit board, each of the probing apparatuses comprising a plurality of probing pins, a command decoding unit, a plurality of transmission switch elements, and a plurality of receiving switch elements;

wherein the connection unit electrically connects the plurality of probe points and the plurality of interface ports with the plurality of probing apparatuses, the plurality of probing pins are electrically connected with the connection unit, the command decoding unit is manufactured with a mixed high-voltage IC process and electrically connected with the plurality of interface ports and controls on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements are manufactured with the mixed high-voltage IC process and transmit the test signal to the corresponding probing pins in response to the control of the command decoding unit, and the plurality of receiving switch elements are manufactured with the mixed high-voltage IC process and generate the probing result corresponding to the plurality of probing pins in response to the control of the command decoding unit.

10. The probing circuit board as claimed in claim 9, wherein the command decoding unit is manufactured with a low-voltage IC process of the mixed high-voltage IC process.

11. The probing circuit board as claimed in claim 10, wherein the low-voltage IC process is a CMOS process.

12. The probing circuit board as claimed in claim 9, wherein the plurality of transmission switch elements and the plurality of receiving switch elements are manufactured with a medium-high voltage IC process of the mixed high-voltage IC process.

13. The probing circuit board as claimed in claim 12, wherein the medium-high voltage IC process is a bipolar transistor process.

14. The probing circuit board as claimed in claim 12, wherein the medium-high voltage IC process is a DMOS process.

15. The probing circuit board as claimed in claim 9, wherein an acceptable voltage range of the plurality of transmission switch elements and the plurality of receiving switch elements is within ±

800 volts.

16. The probing circuit board as claimed in claim 9, wherein the probing apparatus further comprising a verification unit manufactured with the mixed high-voltage IC process for verifying the probing result and transmitting the probing result out.

17. The probing circuit board as claimed in claim 9, further comprising a test signal generation unit for generating the test signal.

18. The probing circuit board as claimed in claim 9, further comprising a verification unit for verifying the probing result.

19. The probing circuit board as claimed in claim 9, further comprising a temperature control and heat sink unit for monitoring an operating temperature of the plurality of probing apparatuses and for decreasing the operating temperature while the operating temperature reaches a predetermined alert level.

20. A probing system for high-voltage matrix probing, the probing system probing an electrically connected object with a test signal and generating a probing result, the probing system comprising:

a plurality of probe points electrically connected with the object;

a control unit for generating a plurality of interface signals and receiving the probing result; and

a plurality of probing circuit boards, each of the probing circuit boards comprising;

a bare printed circuit board;

a connection unit mounted on the bare printed circuit board; and

a plurality of probing apparatuses mounted on the bare printed circuit board, each of the probing apparatuses comprising a plurality of probing pins, a command decoding unit, a plurality of transmission switch elements and a plurality of receiving switch elements;

wherein the connection unit is electrically connected with the plurality of probe points and transmits a plurality of interface signals to the plurality of probing apparatuses, the plurality of probing pins are electrically connected with the connection unit, the command decoding unit is manufactured with a mixed high-voltage IC process and receives the plurality of interface signals to control on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements are manufactured with the mixed high-voltage IC process and transmit the test signal to the corresponding probing pins in response to the control of the command decoding unit, and the plurality of receiving switch elements are manufactured with the mixed high-voltage IC process and generate the probing result corresponding to the plurality of probing pins in response to the control of the command decoding unit.

21. The probing system as claimed in claim 20, wherein the command decoding unit is manufactured with a low-voltage IC process of the mixed high-voltage IC process.

22. The probing system as claimed in claim 21, wherein the low-voltage IC process is a CMOS process.

23. The probing system as claimed in claim 20, wherein the plurality of transmission switch elements and the plurality of receiving switch elements are manufactured with a medium-high voltage IC process of the mixed high-voltage IC process.

24. The probing system as claimed in claim 23, wherein the medium-high voltage IC process is a bipolar transistor process.

25. The probing system as claimed in claim 23, wherein the medium-high voltage IC process is a DMOS process.

26. The probing system as claimed in claim 20, wherein an acceptable voltage range of the plurality of transmission switch elements and the plurality of receiving switch elements is within ±

800 volts.

27. The probing system as claimed in claim 20, wherein the probing apparatus further comprises a verification unit, manufactured with the mixed high-voltage IC process, for verifying the probing result and transmitting the probing result out.

28. The probing system as claimed in claim 20, wherein the probing circuit board further comprises a test signal generation unit for generating the test signal.

29. The probing system as claimed in claim 20, wherein the probing circuit board further comprises a verification unit for verifying the probing result.

30. The probing system as claimed in claim 20, wherein the probing circuit board further comprises a temperature control and heat sink unit for monitoring an operating temperature of the plurality of probing apparatuses and for decreasing the operating temperature while the operating temperature reaches a predetermined alert level.

31. The probing system as claimed in claim 20, further comprising a test signal generation unit for generating the test signal.

32. The probing system as claimed in claim 20, further comprising a verification unit for verifying the probing result.