Thin-film bandpass filter using inductor-capacitor resonators

• US 20070126529A1
• Filed: 04/21/2006
• Published: 06/07/2007
• Est. Priority Date: 12/06/2005
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Chen, Qiang
• Granted Patent: US 7,667,557 B2
• Time in Patent Office: Days
• US Class Current: 333/185
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 27/40 Structural association with built-in electric component, e.g. fuse
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H03H 1/00 Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network constructional details of electromechanical transducers H03H9/00
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence
• CPC Class Codes: H03H 7/1708 Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path H03H7/07 takes precedence
• CPC Class Codes: H03H 7/175 Series LC in series path H03H7/1783 takes precedence
• CPC Class Codes: H03H 7/1791 Combined LC in shunt or branch path

Abstract

A bandpass filter including one or more metal layers, each layer having a first region and a second region. The filter also includes two or more LC resonators and one or more coupling networks for connecting the two or more LC resonators in parallel. The two or more LC resonators are contained within the first region of the one or more layers and the one or more coupling networks are contained in the second region of the one or more layers.

Claims

1. A bandpass filter comprising:

one or more metal layers, each metal layer having a first region and a second region;

two or more LC resonators, the two or more LC resonators contained within the first region of the one or more metal layers; and

one or more coupling networks for connecting the two or more LC resonators in parallel, the one or more coupling networks contained in the second region of the one or more metal layers.

2. The bandpass filter of claim 1 comprising two thin-film metal layers and three LC resonators.

3. The bandpass filter of claim 1 wherein each of the two or more LC resonators include a capacitor and an inductor, the capacitors being positioned in the natural coiling direction of their respective inductors in each LC resonator.

4. The bandpass filter of claim 1 wherein each of the two or more LC resonators includes an inductor, and each inductor of the two or more LC resonators has the same coiling direction.

5. The bandpass filter of claim 1 wherein the two or more LC resonators and the one or more coupling networks are constructed on one side of a substrate.

6. The bandpass filter of claim 1 wherein the one or more coupling networks include microstrip-line structures.

7. The bandpass filter of claim 1 wherein the one or more coupling networks include coil inductors.

8. The bandpass filter of claim 1 wherein each the two or more LC resonators includes an inductor, and each inductor of the two or more LC resonators is in the shape of a rounded rectangular coil.

9. The bandpass filter of claim 1 wherein each the two or more LC resonators includes an inductor, and each inductor of the two or more LC resonators is in the shape of a rectangular coil.

10. The bandpass filter of claim 1 wherein the first region and the second region do not overlap each other.

11. A bandpass filter comprising:

one or more metal layers, each metal layer having a first region and a second region;

two or more LC resonators, the two or more LC resonators contained within the first region of the one or more metal layers;

one or more coupling networks for connecting the two or more LC resonators in parallel, the one or more coupling networks contained in the second region of the one or more metal layers;

an input terminal and an output terminal, the input terminal and output terminal being positioned on opposite sides of a package that contains the bandpass filter; and

two or more ground electrodes including a first and second ground electrode, the first and second ground electrodes being positioned on opposites sides of the package that contains the bandpass filter.

12. The bandpass filter of claim 11 comprising two thin-film metal layers and three LC resonators.

13. The bandpass filter of claim 11 wherein each of the two or more LC resonators include a capacitor and an inductor, the capacitors being positioned in the natural coiling direction of their respective inductors in each LC resonator.

14. The bandpass filter of claim 11 wherein each of the two or more LC resonators includes an inductor, and each inductor of the two or more LC resonators has the same coiling direction.

15. The bandpass filter of claim 11 wherein the two or more LC resonators and the one or more coupling networks are constructed on one side of a substrate.

16. The bandpass filter of claim 11 wherein the one or more coupling networks include microstrip-line structures.

17. The bandpass filter of claim 11 wherein the one or more coupling networks include coil inductors.

18. The bandpass filter of claim 11 wherein each the two or more LC resonators includes an inductor, and each inductor of the two or more LC resonators is in the shape of a rounded rectangular coil.

19. The bandpass filter of claim 11 wherein each the two or more LC resonators includes an inductor, and each inductor of the two or more LC resonators is in the shape of a rectangular coil.

20. The bandpass filter of claim 11 wherein the first region and the second region do not overlap each other.

21. A bandpass filter comprising:

a first thin-film layer and a second thin-film metal layer, each metal layer having a first region and a second region, wherein the first region and the second region do not overlap;

a first, second, and third LC resonator, wherein each LC resonator is contained within the first region of the first and second thin-film metal layers and each LC resonator includes an inductor having the same coiling direction;

a coupling network for connecting the three LC resonators in parallel, the coupling network contained in the second region of the first and second thin-film metal layers;

an input terminal connected to the first LC resonator and an output terminal connected to the third LC resonator, the input terminal and output terminal being positioned on opposite sides of a package that contains the bandpass filter; and

a first and second ground electrode positioned on opposites sides of the package that contains the bandpass filter.