Compact broadband patch antenna

• US 20070126638A1
• Filed: 12/02/2005
• Published: 06/07/2007
• Est. Priority Date: 12/02/2005
• Status: Active Grant

• Current Assignee: CAES Systems LLC
• Original Assignee: M/A Com, Inc. (MACOM Technology Solutions Holdings, Inc.)
• Inventors: Channabasappa, Eswarappa
• Granted Patent: US 7,636,063 B2
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0442 with particular tuning means

Abstract

The invention provides a compact patch antenna having a cavity underneath the driver patch, so that the electromagnetic volume of the antenna is expanded without increasing the overall area of the antenna. More specifically, the compact patch antenna comprises a base layer having a cavity, a ground plane located on the base layer, and having an opening over at least a portion of the cavity, a substrate located on the ground plane, and a driver patch located on the substrate. The invention further provides a method for constructing a compact patch antenna, comprising the steps of providing a base layer having a cavity, providing a ground plane located on the base layer, and having an opening over at least a portion of the cavity, providing a substrate located on the ground plane, and providing a driver patch located on the substrate.

Claims

1. A patch antenna for transmitting or receiving a wireless signal, comprising:

a base layer having a cavity;

a ground plane located on the base layer, and having an opening over at least a portion of the cavity;

a substrate located on the base layer; and

a driver patch located on the substrate.

2. A patch antenna as set forth in claim 1, wherein the ground plane is formed by depositing a conductive material on the bottom of the substrate and the driver patch is formed by depositing a conductive material on the top of the substrate.

3. A patch antenna as set forth in claim 1, wherein at least a portion of the ground plane overlaps the driver patch.

4. A patch antenna as set forth in claim 3, wherein the ground plane opening is centered on, and smaller than, the cavity, such that the ground plane overlaps the driver patch around the entire perimeter of the ground plane.

5. A patch antenna as set forth in claim 1, further comprising:

a parasitic patch; and

a means for supporting the parasitic patch above the driver patch.

6. A patch antenna as set forth in claim 5, wherein the means for supporting the parasitic patch is at least one of (i) a foam layer located between the driver patch and the parasitic patch, and (ii) a radome.

7. A patch antenna as set forth in claim 5, wherein at least one of the driver patch and the parasitic patch includes one or more slots.

8. A patch antenna as set forth in claim 5, wherein the one or more slots are located perpendicular to the E-field of the wireless signal.

9. A method for constructing a patch antenna for transmitting or receiving a wireless signal, comprising the steps of:

providing a base layer having a cavity;

providing a ground plane located on the base layer, and having an opening over at least a portion of the cavity;

providing a substrate located on the ground plane; and

providing a driver patch located on the substrate.

10. A method as set forth in claim 9, wherein the ground plane is formed by depositing a conductive material on the bottom of the substrate and the driver patch is formed by depositing a conductive material on the top of the substrate.

11. A method as set forth in claim 9, wherein at least a portion of the ground plane overlaps the driver patch.

12. A method as set forth in claim 11, wherein the ground plane opening is centered on, and smaller than, the cavity, such that the ground plane overlaps the driver patch around the entire perimeter of the ground plane.

13. A method as set forth in claim 9, further comprising the steps of:

providing a parasitic patch above the driver patch; and

providing a support for the parasitic patch.

14. A method as set forth in claim 13, wherein the step of providing a support includes the step of providing at least one of (i) a dielectric layer located between the driver patch and the parasitic patch, and (ii) a radome.

15. A method as set forth in claim 13, further comprising the step of providing one or more slots in at least one of the driver patch and the parasitic patch.

16. A method as set forth in claim 15, wherein the one or more slots are located perpendicular to the E-field of the wireless signal.