SUBSTRATE HEAT TREATMENT APPARATUS

• US 20070128888A1
• Filed: 12/04/2006
• Published: 06/07/2007
• Est. Priority Date: 12/06/2005
• Status: Active Grant

• Current Assignee: SCREEN Holdings Co., Ltd.
• Original Assignee: SCREEN Holdings Co., Ltd.
• Inventors: Yamaguchi, Akira, Matsuchika, Keiji, Goto, Shigehiro, Morita, Akihiko
• Granted Patent: US 8,003,919 B2
• Time in Patent Office: Days
• US Class Current: 438/795
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

A heat-treating plate has support elements projecting from an upper surface thereof. The support elements are located at apexes of equilateral triangles arranged regularly and continually. The heat-treating plate and a substrate placed on the support elements form a minute space therebetween which is sealed by a sealer. The substrate is sucked by reducing the pressure in the minute space to a negative pressure through exhaust bores. Since all the distances between adjoining support elements are equal, the substrate sags in the same amount between these support elements. With such arrangement of the support elements, sagging of the substrate is inhibited efficiently by a reduced number of support elements.

Claims

1. A substrate heat treatment apparatus for heat-treating a substrate, comprising:

a heat-treating plate;

support devices projecting from an upper surface of said heat-treating plate for contacting and supporting a lower surface of the substrate, said support devices being located at apexes of equilateral triangles arranged regularly and continually on said upper surface;

a seal device disposed annularly on the upper surface of said heat-treating plate for contacting edges of the substrate to render gastight a space formed between the substrate and said heat-treating plate; and

exhaust bores for exhausting gas from said space.

2. An apparatus as defined in claim 1, wherein one of said support devices is located at a center point of said heat-treating plate.

3. An apparatus as defined in claim 1, wherein:

said substrate is circular and 300 mm in diameter;

said space has an inner pressure reduced to −

4 kPa or above and less than 0 Pa by exhaust through said exhaust bores; and

said support devices are arranged at intervals of 35 to 40 mm inclusive.

4. An apparatus as defined in claim 1, wherein said support devices are formed of one of ceramic and resin.

5. An apparatus as defined in claim 1, wherein said heat-treating plate has recesses formed in the upper surface thereof for fixing said support devices.

6. A substrate heat treatment apparatus for heat-treating a substrate, comprising:

a heat-treating plate;

support devices projecting from an upper surface of said heat-treating plate for contacting and supporting a lower surface of the substrate, said support devices being located at intersections of a first group of equidistant, parallel imaginary lines extending across the upper surface of said heat-treating plate, and a second group of imaginary lines rotated 60 degrees from said first group of imaginary lines on the upper surface of said heat-treating plate;

a seal device disposed annularly on the upper surface of said heat-treating plate for contacting edges of the substrate to render gastight a space formed between the substrate and said heat-treating plate; and

exhaust bores for exhausting gas from said space.

7. An apparatus as defined in claim 6, wherein one of said support devices is located at a center point of said heat-treating plate.

8. An apparatus as defined in claim 6, wherein:

said substrate is circular and 300 mm in diameter;

said space has an inner pressure reduced to −

4 kPa or above and less than 0 Pa by exhaust through said exhaust bores; and

said support devices are arranged at intervals of 35 to 40 mm inclusive.

9. An apparatus as defined in claim 6, wherein said support devices are formed of one of ceramic and resin.

10. An apparatus as defined in claim 6, wherein said heat-treating plate has recesses formed in the upper surface thereof for fixing said support devices.

11. A substrate heat treatment apparatus for heat-treating a substrate, comprising:

a heat-treating plate;

a plurality of first support devices arranged regularly on an upper surface of said heat-treating plate for contacting and supporting a lower surface of the substrate;

a seal device disposed annularly on the upper surface of said heat-treating plate for contacting positions inward of edges of the substrate to render gastight a space formed between the substrate and said heat-treating plate; and

exhaust bores for exhausting gas from said space.

12. An apparatus as defined in claim 11, further comprising second support devices for contacting and supporting the lower surface of the substrate, said second support devices being arranged in ranges where said first support devices are relatively sparse, and in positions clear of said first support devices, of a ring-like region of a predetermined width along an inner peripheral surface of the seal device on the upper surface of said heat-treating plate.

13. An apparatus as defined in claim 12, wherein:

said first support devices are located at apexes of equilateral triangles arranged regularly and continually; and

said second support devices are arranged between said seal device and parts, dented toward the center of said heat-treating plate, of an imaginary polygonal line linking those of said first support devices arranged in outermost circumferential positions.

14. An apparatus as defined in claim 12, wherein:

said seal device is shaped annular in plan view;

said first support devices are located at intersections of a first group of equidistant, parallel imaginary lines including an imaginary line passing through a hollow center point of said seal device, and a second group of imaginary lines rotated 60 degrees about said hollow center point from said first group of imaginary lines; and

said second support devices are arranged between said seal device and those of said first support devices arranged in outermost circumferential positions and at a minimum distance to said hollow center point.

15. An apparatus as defined in claim 11, wherein said hollow center point of said seal device coincides with a center point of said heat-treating plate.

16. An apparatus as defined in claim 12, wherein said second support devices are formed of one of ceramic and resin.

17. A substrate heat treatment apparatus for heat-treating a substrate, comprising:

a heat-treating plate;

a plurality of support devices arranged concentrically on an upper surface of said heat-treating plate for contacting and supporting a lower surface of the substrate;

vents for communicating regions inside and outside said support devices;

a seal device disposed annularly on the upper surface of said heat-treating plate for contacting positions inward of edges of the substrate to render gastight a space formed between the substrate and said heat-treating plate; and

exhaust bores for exhausting gas from said space.

18. An apparatus as defined in claim 17, wherein an interval between said seal device and an outermost one of said support devices is smaller than intervals between said support devices.

19. An apparatus as defined in claim 17, wherein said vents are grooves formed in each of said support devices.

20. An apparatus as defined in claim 17, wherein said support devices are formed of one of polyimide resin and fluororesin.