Method of encapsulating a display element
First Claim
Patent Images
1. A method for encapsulating a display element comprising:
- depositing a frit having an optical absorption α
which is a function of wavelength onto a first substrate wherein the deposited frit has a height h;
placing a second substrate in contact with the frit;
sealing together the substrates by traversing a laser beam having a wavelength λ
over the frit at a speed greater than about 0.5 mm/s; and
wherein α
·
h at λ
is greater than or equal to about 0.4.
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Abstract
A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength λ over the frit at a speed greater than about 5 mm/s, and wherein α·h at λ is between 0.4 and about 1.75
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Citations
20 Claims
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1. A method for encapsulating a display element comprising:
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depositing a frit having an optical absorption α
which is a function of wavelength onto a first substrate wherein the deposited frit has a height h;
placing a second substrate in contact with the frit;
sealing together the substrates by traversing a laser beam having a wavelength λ
over the frit at a speed greater than about 0.5 mm/s; and
wherein α
·
h at λ
is greater than or equal to about 0.4. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for encapsulating a display element comprising:
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depositing a frit having an optical absorption α
which is a function of wavelength onto a first substrate in the shape of a wall having a height h;
sandwiching the frit between the first substrate and a second substrate having a display element and at least one electrode disposed thereon, the at least one electrode extending between the frit and the second substrate;
heating the frit by traversing a laser light having a wavelength λ
over the frit through the first substrate at a speed greater than about 5 mm/s to melt the frit and seal together the first and second substrates; and
wherein α
·
h at λ
1 is greater than or equal to about 0.4. - View Dependent Claims (11, 12, 13)
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14. A method of encapsulating a display element comprising:
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depositing a frit having an optical absorption α
which is a function of wavelength onto a first substrate as a wall having a height h;
pre-sintering the frit;
placing the first substrate overtop a second substrate having one or more display elements comprising an organic material and at least one metallic electrode disposed thereon, such that the display element is encircled by the wall and the at least one electrode passes beneath the frit;
heating the frit through the first substrate using a laser beam having a peak wavelength λ
to melt the frit and form a hermetic seal between the first and second substrates; and
wherein α
·
h at λ
is greater than or equal to about 0.4. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification