Transferring die(s) from an intermediate surface to a substrate

• US 20070131016A1
• Filed: 12/13/2005
• Published: 06/14/2007
• Est. Priority Date: 12/13/2005
• Status: Abandoned Application

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Arneson, Michael, Addison, David, Bandy, William, Eastin, David
• Application Number:
  US11/299,896
• Publication Number:
  US 20070131016A1
• Time in Patent Office: Days
• US Class Current: 72/402
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

Dies that are attached to a die plate can be transferred to a substrate. An actuator can be used to cause a die to be released from the die plate and to come into contact with the substrate. For example, the die may cover a corresponding hole in the die plate. The actuator can move a pin into the hole in the die plate, thereby pushing the die from the die plate. The actuator may be actuated by an electromagnetic stimulus. For instance, a solenoid having windings around a tubular core may provide the electromagnetic stimulus to the actuator. Current may be provided to the windings of the solenoid to generate the electromagnetic stimulus that actuates the actuator. The actuator may be provided in the tubular core of the solenoid.

Claims

1. A method of transferring a plurality of integrated circuit dies from a die plate to a substrate, comprising:

(a) receiving a die plate that has a first surface having a die attached thereto, wherein the die covers a hole through the die plate;

(b) positioning the first surface of the die plate and the substrate to be adjacent to each other such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and

(c) applying a stimulus to an actuator to cause the die to be released from the die plate to come into contact with the contact area.

2. The method of claim 1, wherein step (c) includes:

moving a pin of the actuator through the hole in response to the stimulus, wherein moving the pin causes the die to be released from the die plate.

3. The method of claim 1, further comprising:

(d) providing a current to windings of a solenoid to generate the stimulus.

4. The method of claim 1, further comprising:

(d) generating a magnetic force in response to applying the stimulus, wherein the magnetic force causes the die to be released from the die plate.

5. The method of claim 1, further comprising:

(d) maintaining contact between the die plate and a pin plate that includes the actuator using the stimulus.

6. The method of claim 1, wherein step (a) includes:

receiving the die plate having a plurality of dies attached to the first surface of the die plate, the die plate having a plurality of holes therethrough, wherein each die of the plurality of dies covers a corresponding hole through the die plate.

7. The method of claim 6, further comprising:

(d) repeating step (c) for each die of the plurality of dies to cause each die to be released from the die plate to come into contact with a corresponding contact area on the substrate.

8. A method of transferring an integrated circuit die from a die plate to a substrate, comprising:

(a) aligning an actuator pin of an actuator and a hole in a die plate with each other, wherein the hole is covered by a die that is attached to a first surface of the die plate; and

(b) providing an electromagnetic stimulus to the actuator to cause the actuator pin to move into the hole and to detach the die from the first surface.

9. The method of claim 8, further comprising:

(c) providing a current to a solenoid having windings around a tubular core in which the actuator pin is provided to generate the electromagnetic stimulus.

10. The method of claim 8, wherein step (b) includes:

generating a magnetic force, thereby causing the die to be detached from the die plate.

11. The method of claim 8, wherein the electromagnetic stimulus maintains contact between the die plate and a pin plate that includes the actuator.

12. The method of claim 8, wherein step (a) includes:

receiving the die plate having a plurality of dies attached to the first surface of the die plate, the die plate having a plurality of holes therethrough, wherein each die of the plurality of dies covers a corresponding hole through the die plate.

13. The method of claim 12, further comprising:

(c) repeating step (b) for each die of the plurality of dies to cause each die to be detached from the first surface.

14. A system for transferring integrated circuit dies, comprising:

an actuator that includes

a solenoid having windings around a tubular hollow core, and

an actuator pin positioned in the tubular hollow core; and

a die plate having a first surface to which a die is attached, wherein the die covers a corresponding hole through the die plate;

wherein the actuator is configured to move the pin through the hole to detach the die from the first surface of the die plate based on an electromagnetic stimulus generated by the solenoid.

15. The system of claim 14, further comprising:

a die plate holder configured to mount the die plate; and

a substrate supply configured to present a substrate, wherein the die plate holder is further configured to position the first surface of the die plate adjacent to the substrate such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate.

16. The system of claim 14, further comprising:

a current source to provide a current to the windings to cause the pin to be moved toward the die.

17. The system of claim 14, further comprising a pin plate coupled to the die plate by the electromagnetic stimulus provided by the solenoid.

18. The system of claim 14, wherein the first surface of the die plate has a plurality of dies attached thereto, the die plate having a plurality of holes therethrough, and wherein each die of the plurality of dies covers a corresponding hole through the die plate.

19. The system of claim 14, wherein the actuator pin has a head.

20. The system of claim 14, wherein the actuator pin has opposing magnetic poles.

21. A system to transfer integrated circuit dies, comprising:

means for actuating a pin aligned with a hole in a die plate, wherein the hole is covered by a die that is attached to a first surface of the die plate; and

means for providing an electromagnetic stimulus to the means for actuating to cause the pin to move into the hole and to detach the die from the first surface.