Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof

• US 20070131957A1
• Filed: 12/14/2004
• Published: 06/14/2007
• Est. Priority Date: 12/30/2003
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Jager, Harald, Sorg, Jorg
• Granted Patent: US 7,666,715 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

Claims

1. A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic body which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip, wherein said molded plastic body is made of a reaction-curing silicone molding compound.

2. The semiconductor component as in claim 1, wherein said silicone molding compound has a curing time of 10 minutes or less.

3. The semiconductor component as in claim 1, wherein said silicone molding compound has a hardness when cured of 65 Shore D or more.

4. The semiconductor component as in claim 1, wherein said silicone molding compound is a silicone composite material.

5. The semiconductor component as in claim 1, wherein said silicone molding compound contains a conversion material that absorbs at least a portion of an electromagnetic radiation of a first wavelength range emitted by the semiconductor chip and/or received by the semiconductor component and emits electromagnetic radiation of a second wavelength range that is different from the first wavelength range.

6. The semiconductor component as in claim 1, wherein the semiconductor chip emits electromagnetic radiation in the blue or ultraviolet region of the spectrum.

7. The semiconductor component as in claim 1, wherein it has a footprint of approximately 0.5 mm×

1.0 mm or less.

8. The semiconductor component as in claim 1, wherein it has a total component height of 350 μ

m or less, preferably 250 μ

m or less.

9. A method of making a semiconductor component as in claim 1, wherein

the semiconductor chip is attached to a metallic leadframe, a carrier substrate or a carrier sheet comprising the external electrical leads,

the semiconductor chip, including subregions of the leadframe, the carrier substrate or the carrier sheet, is placed in a cavity of an injection mold,

silicone molding compound is injected into the cavity via an injection molding process or a transfer molding process,

the silicone molding compound is cured in the cavity at least such that a shape-stable molded plastic part is formed.

10. The semiconductor component as in claim 2, wherein said silicone molding compound has a hardness when cured of 65 Shore D or more.

11. The semiconductor component as in claim 2, wherein said silicone molding compound is a silicone composite material.

12. The semiconductor component as in claim 3, wherein said silicone molding compound is a silicone composite material.

13. The semiconductor component as in claim 2, wherein said silicone molding compound contains a conversion material that absorbs at least a portion of an electromagnetic radiation of a first wavelength range emitted by the semiconductor chip and/or received by the semiconductor component and emits electromagnetic radiation of a second wavelength range that is different from the first wavelength range.

14. The semiconductor component as in claim 3, wherein said silicone molding compound contains a conversion material that absorbs at least a portion of an electromagnetic radiation of a first wavelength range emitted by the semiconductor chip and/or received by the semiconductor component and emits electromagnetic radiation of a second wavelength range that is different from the first wavelength range.

15. The semiconductor component as in claim 4, wherein said silicone molding compound contains a conversion material that absorbs at least a portion of an electromagnetic radiation of a first wavelength range emitted by the semiconductor chip and/or received by the semiconductor component and emits electromagnetic radiation of a second wavelength range that is different from the first wavelength range.

16. The semiconductor component as in claim 2, wherein the semiconductor chip emits electromagnetic radiation in the blue or ultraviolet region of the spectrum.

17. The semiconductor component as in claim 3, wherein the semiconductor chip emits electromagnetic radiation in the blue or ultraviolet region of the spectrum.

18. The semiconductor component as in claim 4, wherein the semiconductor chip emits electromagnetic radiation in the blue or ultraviolet region of the spectrum.

19. The semiconductor component as in claim 5, wherein the semiconductor chip emits electromagnetic radiation in the blue or ultraviolet region of the spectrum.

20. The semiconductor component as in claim 6, wherein the semiconductor chip emits electromagnetic radiation in the blue or ultraviolet region of the spectrum.