Unipolar resistance random access memory (RRAM) device and vertically stacked architecture

• US 20070132049A1
• Filed: 12/12/2005
• Published: 06/14/2007
• Est. Priority Date: 12/12/2005
• Status: Abandoned Application

• Current Assignee: Hitachi Global Storage Technologies Netherlands BV (Western Digital Corporation)
• Original Assignee: Hitachi Global Storage Technologies Netherlands BV (Western Digital Corporation)
• Inventors: Stipe, Barry
• Application Number:
  US11/301,869
• Publication Number:
  US 20070132049A1
• Time in Patent Office: Days
• US Class Current: 257/421
• CPC Class Codes: G11C 13/0007 comprising metal oxide memory material, e.g. perovskites
• CPC Class Codes: G11C 2213/31 Material having complex metal oxide, e.g. perovskite structure
• CPC Class Codes: G11C 2213/34 Material includes an oxide or a nitride
• CPC Class Codes: G11C 2213/71 Three dimensional array
• CPC Class Codes: G11C 2213/72 Array wherein the access device being a diode
• CPC Class Codes: H10B 63/20 comprising selection components having two electrodes, e.g. diodes
• CPC Class Codes: H10B 63/84 arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
• CPC Class Codes: H10N 70/20 Multistable switching devices, e.g. memristors
• CPC Class Codes: H10N 70/826 adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
• CPC Class Codes: H10N 70/883 Oxides or nitrides
• CPC Class Codes: H10N 70/8833 Binary metal oxides, e.g. TaOx

Abstract

One embodiment of the present invention includes a low-cost unipolar rewritable variable-resistance memory device, made of cross-point arrays of memory cells, vertically stacked on top of one another and compatible with a polycrystalline silicon diode.

Claims

1. A memory structure comprising:

vertically-stacked first and second memory pillars separated by a bit line or word line, the first pillar including,

a first diode having a first direction of current flow;

a first unipolar re-writable resistance random access memory (RRAM) stack formed below the first diode and above a bit line or word line separating the first and second pillars;

the second pillar including,

a second diode positioned to have a second direction of current flow being opposite to the first direction of current flow; and

a second unipolar re-writable RRAM stack formed below the second diode.

2. A memory structure, as recited in claim 1, further including a first bit line formed above the first diode and a second bit line formed at the bottom of the second pillar and below the second stack.

3. A memory structure, as recited in claim 2, further including a first contact layer formed between the first diode and the first bit line and a second contact layer formed between the word line and second diode.

4. A memory structure, as recited in claim 3, further including a first adhesion layer formed between the first bit line and the first contact layer.

5. A memory structure, as recited in claim 2, further including a second adhesion layer formed below the second bit line.

6. A memory structure, as recited in claim 1, further including a first barrier layer formed between the first stack and the first diode and a second barrier layer formed between the second stack and the second diode.

7. A memory structure, as recited in claim 1, wherein the first and second re-writable stacks are each made of metal-insulator-metal (MIM).

8. A memory structure, as recited in claim 7, wherein the insulator in each of the first and second MIM is selected from the group consisting of:

doped Si₃N₄, doped SiO₂, NiO, ZrO₂, HfO₂, TiO₂, Cu₂O, or PCMO.

9. A memory structure, as recited in claim 7, wherein the insulator in each of the first and second MIM is composed of a plurality of distinct insulating layers.

10. A memory structure, as recited in claim 7, wherein each of the metals in the MIM are made of a different composition.

11. A memory structure, as recited in claim 7, wherein the first and second diodes are composed of poly-crystalline silicon.

12. A memory structure, as recited in claim 7, wherein the insulator includes charge traps for nonvolatile trapping of charge wherein the trapped charge causes modulation of resistance.

13. A memory structure, as recited in claim 7, wherein the metal in each of the first and second MIM are each composed at least partially of:

Pt, Ir, Pd, Ru, or Rh.

14. A memory structure, as recited in claim 1, wherein the first and second re-writable stacks are each made of metal-insulator-semiconductor (MIS).

15. A 3-dimensional memory arrangement made of memory trees positioned on top of semiconductor control circuitry comprising:

at least one row of memory trees including a first type of memory tree;

each tree having one tree trunk connecting a corresponding memory tree to the semiconductor control circuitry and each tree having a plurality of branches with at least one branch in each of a plurality of layers defining word lines in a plurality of layers, the word lines of a tree sharing a common vertical connection through the trunk of the tree to the semiconductor control circuitry;

a plurality of bit lines in at least one layer formed substantially perpendicular to the word lines, each of the plurality of bit lines independently connected to the semiconductor control circuitry, each of the bit lines being shared by every tree in the row of memory trees; and

a plurality of unipolar re-writable memory pillars in a plurality of layers formed at the intersections of word lines and bit lines.

16. A 3-dimensional memory arrangement, as recited in claim 15, wherein at least one word line extends on each opposite side of the trunk.

17. A 3-dimensional memory arrangement, as recited in claim 15, wherein each of the plurality of memory pillars includes a diode and a re-writable RRAM stack.

18. A 3-dimensional memory arrangement, as recited in claim 17, wherein diodes are composed of poly-crystalline silicon.

19. A 3-dimensional memory arrangement, as recited in claim 17, wherein the diodes of all of the memory pillars point in the same direction.

20. A 3-dimensional memory arrangement, as recited in claim 17, wherein each of the RRAM stacks is made of metal-insulator-metal (MIM).

21. A 3-dimensional memory arrangement, as recited in claim 17, wherein each of the RRAM stacks is made of metal-insulator-semiconductor (MIS).

22. A 3-dimensional memory arrangement, as recited in claim 15, wherein each trunk is made of tungsten.

23. A 3-dimensional memory arrangement, as recited in claim 15, wherein memory pillars are formed above and below the plurality of branches and including diodes, the diodes of the memory pillars formed on top of the plurality of branches point in a direction opposite to that of the diodes of the memory pillars formed below the plurality of branches.

24. A 3-dimensional memory arrangement, as recited in claim 15, wherein memory pillars are formed above and below the plurality of bit lines and including diodes, the diodes of the memory pillars formed on top of the plurality of bit lines point in a direction opposite to that of the diodes of the memory pillars formed below the plurality of bit lines.

25. A 3-dimensional memory arrangement, as recited in claim 15, wherein the at least one row of memory trees includes a second type of memory trees, said first and second types of memory trees positioned adjacent relative to each other.

26. A 3-dimensional memory arrangement, as recited in claim 25, wherein bit lines of said first and second types of memory trees are shared.

27. A 3-dimensional memory arrangement, as recited in claim 25, wherein word lines of said first and second types of memory trees are shared.

28. A 3-dimensional memory arrangement, as recited in claim 25, wherein bit lines and word lines of said first and second types of memory trees are shared.

29. A 3-dimensional memory arrangement, as recited in claim 25, wherein the first type of memory tree is offset from the second type of memory tree.

30. A 3-dimensional memory arrangement, as recited in claim 25, wherein the distance from the trunk of a first type of memory tree to the trunk of the next adjacent first type of memory tree is 4F.

31. A 3-dimensional memory arrangement, as recited in claim 25, wherein the second type of memory trees are a mirror image of the first type of memory trees.

32. A 3-dimensional memory arrangement, as recited in claim 25, wherein the arrangement includes a plurality of alternating first type and second type of memory trees.

33. A method of manufacturing a memory array having memory pillars comprising:

depositing a conducting layer;

first etching to form the first layer of bit lines or word lines;

depositing a first SiO₂ layer;

performing chemical mechanical planarization (CMP);

depositing re-writable RRAM stack memory layers;

depositing diode layers to form a diode having a first direction of current flow;

second etching the deposited memory layers and diode layers;

forming a pillar;

depositing a second SiO₂ layer; and

performing CMP.

34. A method of manufacturing a memory array, as recited in claim 33, further including depositing a barrier layer between the diode layers and the memory layers.

35. A method of manufacturing a memory array, as recited in claim 33, further including depositing a contact layer prior to the second etching step, to be used as a hard stop layer, and planarizing to the hard stop layer.

36. A method of manufacturing a memory array, as recited in claim 33, further including depositing a contact layer and a sacrificial hard stop layer prior to the second etching step, planarizing to the hard stop layer and etching to remove the hard stop layer.

37. A method of manufacturing a memory array, as recited in claim 33, further including the steps of:

depositing a third SiO₂ layer prior to the step of depositing a conducting layer;

planarizing the deposited third SiO₂ layer; and

depositing an adhesion layer.

38. A method of manufacturing a memory array, as recited in claim 35, further including repeating the steps of claim 33 except replacing the depositing the diode layers step with the step of depositing diode layers to form a diode having a second direction of current flow opposite to that of the first current flow.

39. A memory structure comprising:

a first memory pillar formed above a bit line and including,

a first unipolar re-writable resistance random access memory (RRAM) stack;

a first diode having a first direction of current flow and formed above the first stack; and

a word line formed above the first memory pillar.

40. A memory structure, as recited in claim 39, wherein the re-writable stack is made of metal-insulator-metal (MIM).

41. A memory structure, as recited in claim 40, further including a second memory pillar formed above the word line and including,

a second unipolar re-writable RRAM stack formed above the word line;

and

a second diode positioned to have a second direction of current flow being opposite to the first direction of current flow and formed above the second stack.