LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION
First Claim
Patent Images
1. A light-emitting diode (LED) assembly, comprising:
- a packaged LED module including at least an LED die therein and a plurality of conductive pins extending downwardly from a bottom portion thereof; and
a heat dissipation device thermally and electrically connected with the at least an LED die, the heat dissipation device defining at least a mounting hole therein, at least one of the conductive pins being fittingly received in the at least a mounting hole.
1 Assignment
0 Petitions
Accused Products
Abstract
An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.
-
Citations
19 Claims
-
1. A light-emitting diode (LED) assembly, comprising:
-
a packaged LED module including at least an LED die therein and a plurality of conductive pins extending downwardly from a bottom portion thereof; and
a heat dissipation device thermally and electrically connected with the at least an LED die, the heat dissipation device defining at least a mounting hole therein, at least one of the conductive pins being fittingly received in the at least a mounting hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method for forming a light-emitting diode (LED) assembly, comprising steps of:
-
providing a packaged LED module, wherein the LED module includes at least an LED die therein and a plurality of conductive pins extending downwardly from a bottom portion thereof; and
thermally and electrically connecting the at least an LED die to a heat dissipation device by inserting at least one of the conductive pins into at least a mounting hole defined in the heat dissipation device. - View Dependent Claims (12, 13)
-
-
14. An LED assembly comprising:
-
an LED module having at least an LED die therein and at least first and second conductive pins electrically connecting with the at least an LED die;
a heat dissipation device made of metal and having a plurality of fins thereon, electrically and thermally connecting with the at least first conductive pin of the LED module;
a power source line electrically connecting with the at least second conductive pin, adapted for electrically connecting the at least second conductive pin with a power source; and
a conductive post electrically connecting with the heat dissipation device, adapted for electrically connecting the at least first conductive pin with the power source. - View Dependent Claims (15, 16, 17, 18, 19)
-
Specification