LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION

• US 20070132092A1
• Filed: 07/20/2006
• Published: 06/14/2007
• Est. Priority Date: 12/09/2005
• Status: Active Grant

• Current Assignee: Foxconn Technology Co., Ltd.
• Original Assignee: Foxconn Technology Co., Ltd.
• Inventors: LIN, YEU-LIH, HU, TSENG-HSIANG, TAN, LI-KUANG
• Granted Patent: US 7,598,535 B2
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 23/00 Arrangement of electric circuit elements in or on lighting devices characterised by cooling arrangements F21V29/508
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10S 257/93 Thermoelectric, e.g. peltier effect cooling

Abstract

An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.

Claims

1. A light-emitting diode (LED) assembly, comprising:

a packaged LED module including at least an LED die therein and a plurality of conductive pins extending downwardly from a bottom portion thereof; and

a heat dissipation device thermally and electrically connected with the at least an LED die, the heat dissipation device defining at least a mounting hole therein, at least one of the conductive pins being fittingly received in the at least a mounting hole.

2. The assembly of claim 1, wherein the heat dissipation device has a protrusion thereon, the at least a mounting hole being defined in the protrusion.

3. The assembly of claim 2, wherein the heat dissipation device includes a column and a plurality of fins extending from an outer periphery of the column, the protrusion being projected outwardly from one end of the column.

4. The assembly of claim 2, wherein the heat dissipation device includes a chassis and a plurality of fins extending from the chassis, the protrusion being projected outwardly from a surface of the chassis.

5. The assembly of claim 1, wherein the heat dissipation device has a recess therein, and the LED module has a mounting portion, the mounting portion being received in the recess.

6. The assembly of claim 1, further comprising a power source line, the line being electrically connected to one of the conductive pins.

7. The assembly of claim 6, wherein the heat dissipation device defines a slot therein, the line being received in the slot.

8. The assembly of claim 6, wherein the LED module contains a plurality of LED dies, the one of the conductive pins to which the line is electrically connected functioning as a common pole for the LED dies, the rest of the conductive pins being thermally and electrically connected to the heat dissipation device.

9. The assembly of claim 6, further comprising a mounting frame, the mounting frame joining the LED module, the heat dissipation device and the line together.

10. The assembly of claim 9, wherein a conductive pin is attached to the mounting frame and electrically connected to the heat dissipation device.

11. A method for forming a light-emitting diode (LED) assembly, comprising steps of:

providing a packaged LED module, wherein the LED module includes at least an LED die therein and a plurality of conductive pins extending downwardly from a bottom portion thereof; and

thermally and electrically connecting the at least an LED die to a heat dissipation device by inserting at least one of the conductive pins into at least a mounting hole defined in the heat dissipation device.

12. The method of claim 11, further comprising a step of electrically connecting a power source line to one of the conductive pins.

13. The method of claim 12, further comprising a step of joining the LED module, the heat dissipation device and the line together via a mounting frame.

14. An LED assembly comprising:

an LED module having at least an LED die therein and at least first and second conductive pins electrically connecting with the at least an LED die;

a heat dissipation device made of metal and having a plurality of fins thereon, electrically and thermally connecting with the at least first conductive pin of the LED module;

a power source line electrically connecting with the at least second conductive pin, adapted for electrically connecting the at least second conductive pin with a power source; and

a conductive post electrically connecting with the heat dissipation device, adapted for electrically connecting the at least first conductive pin with the power source.

15. The LED assembly of claim 14, further comprising a mounting frame and a light reflector, wherein the heat dissipation device is received in the mounting frame, the light reflector is mounted on the heat dissipation device and the at least an LED module is mounted on the light reflector.

16. The LED assembly of claim 15, wherein the heat dissipation device has an upper protrusion extending through the light reflector, and the conductive post is fixed on a bottom plate of the mounting frame.

17. The LED assembly of claim 14, wherein the heat dissipation device has a central column and the fins are circular-shaped and extend laterally outwardly from an outer periphery of the central column.

18. The LED assembly of claim 14, wherein the heat dissipation device has an upper chassis and the fins extend downwardly from the chassis.

19. The LED assembly of claim 14, wherein the heat dissipation device has a central column and the fins extend longitudinally and radially outwardly from a periphery of the central column.