Cooling system for electronic components
First Claim
1. A cooling system for an electronic device, comprising:
- a housing defining an interior space;
at least one heat producing electronic component mounted in said interior space;
said housing comprising sidewalls and end walls, and a coolant passageway extending from an inlet in one end wall, through a sidewall to the second end wall, through the second end wall to a second sidewall, and through the second sidewall back to an outlet in the first end wall;
a cooling liquid in the interior space in contact with the heat producing electronic component; and
a cooling fluid in the coolant passageway;
wherein said cooling liquid is adapted to remove heat from the heat producing electronic component inside the housing, and said cooling fluid is adapted to remove heat from the housing and from the cooling liquid in the interior space.
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Accused Products
Abstract
Electrical components that generate heat are housed within the body (18) of a housing (12). The housing body (18) is preferably a one-piece extrusion closed at its ends by end walls (20, 22). An inlet fitting (40) in end wall (20) communicates with an adjacent end of passageway section (34). The adjacent end of passageway section (36) communicates with an outlet fitting (42). In use, a body of a cooling fluid is placed inside of the housing (12) in contact with the electronic components in the housing (12) that generate heat. A second cooling fluid is introduced into the inlet (40) and caused to flow through first the passageway section (34), then through a passageway section in end wall (22), then through the passageway section (36) in sidewall (28), and then out through the outlet fitting (42). This circulating cooling fluid removes heat from the housing (12) and the cooling fluid inside of the housing (12).
37 Citations
22 Claims
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1. A cooling system for an electronic device, comprising:
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a housing defining an interior space;
at least one heat producing electronic component mounted in said interior space;
said housing comprising sidewalls and end walls, and a coolant passageway extending from an inlet in one end wall, through a sidewall to the second end wall, through the second end wall to a second sidewall, and through the second sidewall back to an outlet in the first end wall;
a cooling liquid in the interior space in contact with the heat producing electronic component; and
a cooling fluid in the coolant passageway;
wherein said cooling liquid is adapted to remove heat from the heat producing electronic component inside the housing, and said cooling fluid is adapted to remove heat from the housing and from the cooling liquid in the interior space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A cooling system for an electronic device, comprising:
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a housing defining an interior space;
at least one heat-producing electronic component mounted in said interior said space;
a cooling fluid in the interior space in contact with the heat-producing electronic component;
a coolant passageway in the housing having an inlet and an outlet; and
a cooling fluid in the coolant passageway;
wherein said cooling liquid is adapted to remove heat from the heat-producing electronic component inside the housing, and said cooling fluid is adapted to remove heat from the cooling liquid in the interspace. - View Dependent Claims (22)
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Specification