Methods and systems for binning defects detected on a specimen

• US 20070133860A1
• Filed: 12/14/2005
• Published: 06/14/2007
• Est. Priority Date: 12/14/2005
• Status: Active Grant

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Lin, Jason, Wu, Kenong, McCauley, Sharon, Chu, Xing
• Granted Patent: US 7,570,800 B2
• Time in Patent Office: Days
• US Class Current: 382/149
• CPC Class Codes: G01N 2021/8854 Grading and classifying of flaws
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image.

Claims

1. A computer-implemented method for binning defects detected on a specimen, comprising:

comparing a test image to reference images, wherein the test image comprises an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen, and wherein the reference images comprise images of one or more patterned features associated with different regions of interest within a device being formed on the specimen; and

if the one or more patterned features of the test image match the one or more patterned features of one of the reference images, assigning the defect to a bin corresponding to the region of interest associated with the one of the reference images.

2. The method of claim 1, wherein the different regions of interest comprise regions of the device in which defects of interest may be present.

3. The method of claim 1, wherein the different regions of interest do not comprise regions of the device in which nuisance defects may be present.

4. The method of claim 1, wherein if the one or more patterned features of the test image do not match the one or more patterned features of any of the reference images, the method further comprises identifying the defect as a nuisance defect.

5. The method of claim 1, wherein the reference images further comprise images of one or more patterned features associated with regions of the device in which nuisance defects may be present, and wherein if the one or more patterned features of the test image match the one or more patterned features of one of the reference images associated with the regions of the device in which nuisance defects may be present, the method further comprises identifying the defect as a nuisance defect.

6. The method of claim 5, wherein if the one or more patterned features of the test image do not match the one or more patterned features of any of the reference images, the method further comprises identifying the defect as a nuisance defect.

7. The method of claim 1, wherein the test image further comprises an image of the defect.

8. The method of claim 1, wherein the test image is acquired at a location on the specimen spaced from the defect at which the one or more patterned features are located and at which additional defects are not located.

9. The method of claim 1, further comprising identifying the regions of interest containing potentially problematic portions of the design of the device based on results of said assigning.

10. The method of claim 1, further comprising identifying potentially problematic processes used to fabricate the specimen based on results of said assigning.

11. The method of claim 1, wherein if the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method further comprises determining if the defect is a repeating defect.

12. The method of claim 1, further comprising classifying the defect based on one or more attributes of the defect.

13. The method of claim 1, further comprising classifying the defect based on one or more attributes of the defect and one or more attributes of the one or more patterned features formed on the specimen proximate to the defect.

14. The method of claim 1, further comprising sampling the defects detected on the specimen for additional processing based on results of said assigning.

15. The method of claim 1, further comprising locating additional instances of the one or more patterned features proximate to the defect in the device.

16. The method of claim 1, further comprising locating additional instances of the one or more patterned features proximate to the defect on the specimen.

17. The method of claim 1, further comprising acquiring the test image by optical inspection.

18. The method of claim 1, further comprising acquiring the test image by electron beam inspection.

19. The method of claim 1, further comprising acquiring the test image by electron beam review.

20. The method of claim 1, further comprising acquiring the test image by an aerial image projection technique.

21. The method of claim 1, wherein method is performed during inspection of the specimen.

22. The method of claim 1, wherein the method is performed using the test image acquired during inspection of the specimen.

23. The method of claim 1, wherein the method is performed during review of the defects.

24. The method of claim 1, further comprising acquiring the test image by analyzing design data for the device being formed on the specimen.

25. The method of claim 1, further comprising performing the method in conjunction with statistical methods performed on the test image.

26. A computer-implemented method for binning defects detected on a specimen, comprising:

comparing a first test image to a second test image, wherein the first test image comprises an image of one or more patterned features formed on the specimen proximate to a first defect detected on the specimen, and wherein the second test image comprises an image of one or more patterned features formed on the specimen proximate to a second defect detected on the specimen; and

if the one or more patterned features in the first and second test images match, assigning the first and second defects to the same bin.

27. The method of claim 26, wherein the first and second test images further comprise images of the first and second defects, respectively.

28. The method of claim 26, wherein the first and second test images are acquired at locations on the specimen spaced from the first and second defects, respectively, at which the one or more patterned features are located and at which additional defects are not located.

29. The method of claim 26, further comprising identifying potentially problematic portions of the design of a device being formed on the specimen based on results of said assigning.

30. The method of claim 26, further comprising identifying potentially problematic processes used to fabricate the specimen based on results of said assigning.

31. The method of claim 26, further comprising identifying a sample of the defects detected on the specimen to be reviewed based on results of the assigning step.

32. The method of claim 26, wherein if the one or more patterned features in the first and second test images match, the method further comprises determining if the first and second defects are repeating defects.

33. The method of claim 26, further comprising classifying the first and second defects based on one or more attributes of the first and second defects, respectively.

34. The method of claim 26, further comprising classifying the first and second defects based on one or more attributes of the first and second defects, respectively, and one or more attributes of the one or more patterned features proximate to the first and second defects, respectively.

35. The method of claim 26, further comprising creating a subset of the defects based on locations of the defects within a die formed on the specimen or locations of the defects on the specimen and classifying the subset based on one or more attributes of the one or more patterned features proximate to the defects within the subset.

36. The method of claim 26, further comprising using the one or more patterned features proximate to the defects in a simulation of design data for a device being formed on the specimen to classify the defects.

37. The method of claim 26, further comprising acquiring the first and second test images by optical inspection.

38. The method of claim 26, further comprising acquiring the first and second test images by electron beam inspection.

39. The method of claim 26, further comprising acquiring the first and second test images by electron beam review.

40. The method of claim 26, further comprising acquiring the first and second test images by an aerial image projection technique.

41. The method of claim 26, wherein the method is performed during inspection of the specimen.

42. The method of claim 26, wherein the method is performed using the first and second test images acquired during inspection of the specimen.

43. The method of claim 26, wherein the method is performed during review of the defects.

44. The method of claim 26, further comprising acquiring the first and second test images by analyzing design data for the specimen.

45. The method of claim 26, further comprising performing the method in conjunction with statistical methods performed on the first and second test images.

46. A carrier medium, comprising program instructions executable on a computer system for performing a method for binning defects detected on a specimen, wherein the method comprises:

comparing a test image to reference images, wherein the test image comprises an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen, and wherein the reference images comprise images of one or more patterned features associated with different regions of interest within a device being formed on the specimen; and

if the one or more patterned features of the test image match the one or more patterned features of one of the reference images, assigning the defect to a bin corresponding to the region of interest associated with the one of the reference images.

47. A system configured to bin defects detected on a specimen, comprising:

an inspection subsystem configured to acquire a test image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen;

a computer subsystem; and

a carrier medium comprising program instructions executable on the computer subsystem for;

comparing the test image to reference images, wherein the reference images comprise images of one or more patterned features associated with different regions of interest within a device being formed on the specimen; and

if the one or more patterned features of the test image match the one or more patterned features of one of the reference images, assigning the defect to a bin corresponding to the region of interest associated with the one of the reference images.

48. The system of claim 47, wherein the inspection subsystem is further configured to acquire the reference images.